Invention Application
- Patent Title: DEVICES INCLUDING DIELECTRIC LAYERS(S) AND INTERFACE LAYERS(S)
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Application No.: US15141948Application Date: 2016-04-29
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Publication No.: US20170317466A1Publication Date: 2017-11-02
- Inventor: Xue Huang , Di Liang
- Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Main IPC: H01S5/026
- IPC: H01S5/026 ; H01S5/06 ; H01L29/94 ; H01L29/78 ; H01L29/51 ; H01S5/30 ; H01L29/423
Abstract:
An example device in accordance with an aspect of the present disclosure includes at least one dielectric layer sandwiched between first and second layers, to provide a dielectric characteristic for the device. At least one interface layer, disposed between the at least one dielectric layer and at least one of i) the first layer, and ii) the second layer, is to serve as bond enhancement between the at least one dielectric layer and other layers.
Information query
