- 专利标题： Semiconductor Packaging Structure and Method
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申请号： US15791071申请日： 2017-10-23
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公开(公告)号： US20180047708A1公开(公告)日： 2018-02-15
- 发明人: Chun-Cheng Lin , Chung-Shi Liu , Kuei-Wei Huang , Cheng-Ting Chen , Wei-Hung Lin , Ming-Da Cheng
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 主分类号： H01L25/065
- IPC分类号： H01L25/065 ; H01L23/00 ; H01L23/31 ; H01L21/027 ; H01L25/10 ; H01L25/00 ; H01L23/498 ; H01L21/48 ; H01L21/768 ; H01L21/56
摘要：
A system and method for packaging semiconductor dies is provided. An embodiment comprises a first package with a first contact and a second contact. A post-contact material is formed on the first contact in order to adjust the height of a joint between the contact pad a conductive bump. In another embodiment a conductive pillar is utilized to control the height of the joint between the contact pad and external connections.
公开/授权文献
- US11158605B2 Semiconductor packaging structure and method 公开/授权日：2021-10-26
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