公开(公告)号：US20230307404A1

公开(公告)日：2023-09-28

申请号：US17705385

申请日：2022-03-28

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Cheng-Yu Kuo ,  Yu-Ching Lo ,  Wei-Jie Huang ,  Ching-Pin Yuan ,  Yi-Che Chiang ,  Kris Lipu Chuang ,  Hsin-Yu Pan ,  Yi-Yang Lei ,  Ching-Hua Hsieh ,  Kuei-Wei Huang

IPC分类号： H01L23/00 ,  H01L21/48 ,  H01L23/498

CPC分类号： H01L24/20 ,  H01L21/4857 ,  H01L23/49822 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/19 ,  H01L24/32 ,  H01L24/83 ,  H01L25/105 ,  H01L2224/13021 ,  H01L2224/14181 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/32225

摘要： A package structure includes a die, a first redistribution circuit structure, a first redistribution circuit structure, a second redistribution circuit structure, an enhancement layer, first conductive terminals, and second conductive terminals. The first redistribution circuit structure is disposed on a rear side of the die and electrically coupled to thereto. The second redistribution circuit structure is disposed on an active side of the die and electrically coupled thereto. The enhancement layer is disposed on the first redistribution circuit structure. The first redistribution circuit structure is disposed between the enhancement layer and the die. The first conductive terminals are connected to the first redistribution circuit structure. The first redistribution circuit structure is between the first conductive terminals and the die. The second conductive terminals are connected to the second redistribution circuit structure. The enhancement layer is between the second conductive terminals and the second redistribution circuit structure.

公开(公告)号：US11749535B2

公开(公告)日：2023-09-05

申请号：US16046211

申请日：2018-07-26

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Meng-Tse Chen ,  Hsiu-Jen Lin ,  Wei-Hung Lin ,  Kuei-Wei Huang ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC分类号： H01L21/56 ,  H01L23/00 ,  H01L25/065 ,  H01L25/10 ,  H01L25/00

CPC分类号： H01L21/563 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/06181 ,  H01L2224/1144 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11849 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/13172 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/14505 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/8123 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2224/94 ,  H01L2224/81 ,  H01L2224/13111 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2224/13166 ,  H01L2924/00014 ,  H01L2224/13172 ,  H01L2924/00014 ,  H01L2224/13124 ,  H01L2924/00014 ,  H01L2224/13155 ,  H01L2924/00014 ,  H01L2224/97 ,  H01L2224/81 ,  H01L2224/94 ,  H01L2224/11

摘要： A system and method for applying an underfill is provided. An embodiment comprises applying an underfill to a substrate and patterning the underfill. Once patterned other semiconductor devices, such as semiconductor dies or semiconductor packages may then be attached to the substrate through the underfill, with electrical connections from the other semiconductor devices extending into the pattern of the underfill.

公开(公告)号：US10600709B2

公开(公告)日：2020-03-24

申请号：US16050669

申请日：2018-07-31

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Meng-Tse Chen ,  Wei-Hung Lin ,  Chih-Wei Lin ,  Kuei-Wei Huang ,  Hui-Min Huang ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC分类号： H01L21/00 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498

摘要： A device comprises a first package component, and a first metal trace and a second metal trace on a top surface of the first package component. The device further includes a dielectric mask layer covering the top surface of the first package component, the first metal trace and the second metal trace, wherein the dielectric mask layer has an opening therein exposing the first metal trace. The device also includes a second package component and an interconnect formed on the second package component, the interconnect having a metal bump and a solder bump formed on the metal bump, wherein the solder bump contacts the first metal trace in the opening of the dielectric mask layer.

公开(公告)号：US20190279958A1

公开(公告)日：2019-09-12

申请号：US16121888

申请日：2018-09-05

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Wei-Yu Chen ,  Chia-Shen Cheng ,  Hao-Jan Pei ,  Philip Yu-Shuan Chung ,  Kuei-Wei Huang ,  Yu-Peng Tsai ,  Hsiu-Jen Lin ,  Ching-Hua Hsieh ,  Chen-Hua Yu ,  Chung-Shi Liu

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/56

摘要： A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.

公开(公告)号：US20180358325A1

公开(公告)日：2018-12-13

申请号：US16051235

申请日：2018-07-31

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Kuei-Wei Huang ,  Hsiu-Jen Lin ,  Ai-Tee Ang ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC分类号： H01L23/00

CPC分类号： H01L24/81 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/97 ,  H01L2224/11334 ,  H01L2224/11422 ,  H01L2224/11424 ,  H01L2224/1308 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/16227 ,  H01L2224/75101 ,  H01L2224/75252 ,  H01L2224/75253 ,  H01L2224/75283 ,  H01L2224/75651 ,  H01L2224/75754 ,  H01L2224/759 ,  H01L2224/7598 ,  H01L2224/8113 ,  H01L2224/81132 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/8122 ,  H01L2224/81224 ,  H01L2224/8123 ,  H01L2224/81801 ,  H01L2224/81805 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/3511 ,  Y10T29/49144 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01047 ,  H01L2924/01029

摘要： Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices are disclosed. In some embodiments, a method of using a tool for processing semiconductor devices includes a tool with a second material disposed over a first material, and a plurality of apertures disposed within the first material and the second material. The second material comprises a higher reflectivity than the first material. Each of the apertures is adapted to retain a package component over a support during an exposure to energy.

公开(公告)号：US10153180B2

公开(公告)日：2018-12-11

申请号：US14044504

申请日：2013-10-02

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Meng-Tse Chen ,  Hsiu-Jen Lin ,  Wei-Hung Lin ,  Kuei-Wei Huang ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC分类号： H01L21/56 ,  H01L23/00

摘要： A system and method for applying an underfill is provided. An embodiment comprises applying an underfill to a substrate and patterning the underfill. Once patterned other semiconductor devices, such as semiconductor dies or semiconductor packages may then be attached to the substrate through the underfill, with electrical connections from the other semiconductor devices extending into the pattern of the underfill.

公开(公告)号：US09397062B2

公开(公告)日：2016-07-19

申请号：US14585534

申请日：2014-12-30

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Kuei-Wei Huang ,  Wei-Yu Chen ,  Meng-Tse Chen ,  Wei-Hung Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC分类号： H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  H01L23/31 ,  H01L21/56 ,  H01L25/03 ,  H01L25/065 ,  H01L25/10 ,  H01L25/00 ,  H01L23/48

CPC分类号： H01L25/105 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/538 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05557 ,  H01L2224/056 ,  H01L2224/05611 ,  H01L2224/05613 ,  H01L2224/05616 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05684 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13564 ,  H01L2224/136 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16058 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1705 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81007 ,  H01L2224/81193 ,  H01L2224/831 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01083 ,  H01L2924/00014

摘要： The described embodiments of mechanisms of forming a die package and package on package (PoP) structure involve forming a solder paste layer over metal balls of external connectors of a die package. The solder paste layer protects the metal balls from oxidation. In addition, the solder paste layer enables solder to solder bonding with another die package. Further, the solder paste layer moves an intermetallic compound (IMC) layer formed between the solder paste layer and the metal balls below a surface of a molding compound of the die package. Having the IMC layer below the surface strengthens the bonding structure between the two die packages.

公开(公告)号：US20150187723A1

公开(公告)日：2015-07-02

申请号：US14585534

申请日：2014-12-30

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Kuei-Wei Huang ,  Wei-Yu Chen ,  Meng-Tse Chen ,  Wei-Hung Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC分类号： H01L23/00

CPC分类号： H01L25/105 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/538 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05147 ,  H01L2224/05557 ,  H01L2224/056 ,  H01L2224/05611 ,  H01L2224/05613 ,  H01L2224/05616 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05684 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13564 ,  H01L2224/136 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16058 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1705 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81007 ,  H01L2224/81193 ,  H01L2224/831 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01083 ,  H01L2924/00014

摘要： The described embodiments of mechanisms of forming a die package and package on package (PoP) structure involve forming a solder paste layer over metal balls of external connectors of a die package. The solder paste layer protects the metal balls from oxidation. In addition, the solder paste layer enables solder to solder bonding with another die package. Further, the solder paste layer moves an intermetallic compound (IMC) layer formed between the solder paste layer and the metal balls below a surface of a molding compound of the die package. Having the IMC layer below the surface strengthens the bonding structure between the two die packages.

摘要翻译： 形成模具封装和封装（PoP）结构的机构的所述实施例涉及在管芯封装的外部连接器的金属球上形成焊膏层。 焊膏层保护金属球免受氧化。 此外，焊膏层能够使焊料与另一个管芯封装焊接。 此外，焊膏层将形成在焊膏层和金属球之间的金属间化合物（IMC）层移动到模具封装的模塑料的表面下方。 使表面下方的IMC层增强了两个管芯封装之间的结合结构。

公开(公告)号：US20150179624A1

公开(公告)日：2015-06-25

申请号：US14638839

申请日：2015-03-04

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Chih-Wei Lin ,  Ming-Da Cheng ,  Meng-Tse Chen ,  Wen-Hsiung Lu ,  Kuei-Wei Huang ,  Chung-Shi Liu

IPC分类号： H01L25/00 ,  H01L23/522 ,  H01L23/00 ,  H01L25/10

CPC分类号： H01L25/50 ,  H01L21/31051 ,  H01L21/31127 ,  H01L21/565 ,  H01L21/568 ,  H01L21/76885 ,  H01L21/786 ,  H01L23/3128 ,  H01L23/49805 ,  H01L23/49816 ,  H01L23/5226 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/13 ,  H01L24/16 ,  H01L24/24 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/02371 ,  H01L2224/02381 ,  H01L2224/03618 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13164 ,  H01L2224/16225 ,  H01L2224/19 ,  H01L2224/27019 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/81005 ,  H01L2224/82005 ,  H01L2224/83005 ,  H01L2224/92125 ,  H01L2224/92244 ,  H01L2225/06513 ,  H01L2225/0652 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1047 ,  H01L2225/1058 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00

摘要： A device includes an inter-layer dielectric, a device die under the inter-layer dielectric; and a die-attach film under the inter-layer dielectric and over the device die, wherein the die-attach film is attached to the device die. A plurality of redistribution lines includes portions level with the die-attach film. A plurality of Z-interconnects is electronically coupled to the device die and the plurality of redistribution lines. A polymer-comprising material is under the inter-layer dielectric. The device die, the die-attach film, and the plurality of Z-interconnects are disposed in the polymer-comprising material.

公开(公告)号：US20140264856A1

公开(公告)日：2014-09-18

申请号：US13922117

申请日：2013-06-19

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Kuei-Wei Huang ,  Chih-Wei Lin ,  Hsiu-Jen Lin ,  Wei-Hung Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC分类号： H01L23/00 ,  H01L25/07

CPC分类号： H01L25/50 ,  H01L21/4853 ,  H01L21/4867 ,  H01L21/565 ,  H01L23/147 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L25/074 ,  H01L25/105 ,  H01L2021/60045 ,  H01L2021/60135 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A package includes a package component, which further includes a top surface and a metal pad at the top surface of the package component. The package further includes a non-reflowable electrical connector over and bonded to the metal pad, and a molding material over the package component. The non-reflowable electrical connector is molded in the molding material and in contact with the molding material. The non-reflowable electrical connector has a top surface lower than a top surface of the molding compound.

摘要翻译： 包装包括包装部件，其还包括顶部表面和在包装部件的顶部表面处的金属垫。 该封装还包括一个不可回流的电连接器，并且连接到金属焊盘上，以及一个在封装部件上的模制材料。 不可回流的电连接器在模制材料中模制并与模制材料接触。 不可回流的电连接器具有比模塑料的顶表面低的顶表面。