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公开(公告)号：US20230067313A1
公开(公告)日：2023-03-02
申请号：US17462023
申请日：2021-08-31
发明人： Jen-Jui Yu , Hao-Jan Pei , Cheng-Ting Chen , Chih-Chiang Tsao , Hsiu-Jen Lin , Ching-Hua Hsieh
IPC分类号： H01L23/02 , H01L23/31 , H01L23/485 , H01L25/16 , H01L21/56
摘要： A package structure includes a die, an encapsulation layer, a redistribution layer structure and an adhesive material. The die includes a semiconductor substrate, conductive pads disposed over the semiconductor substrate and a passivation layer disposed over the semiconductor substrate and around the conductive pads. The encapsulation layer laterally encapsulates the die. the redistribution layer structure is disposed on the die and the encapsulation layer, and includes at least one redistribution layer embedded in at least one polymer layer, and the polymer layer contacts a portion of the passivation layer. The adhesive material is disposed on the die and covers an interface between the polymer layer and the passivation layer.
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公开(公告)号：US20170098571A1
公开(公告)日：2017-04-06
申请号：US15380671
申请日：2016-12-15
发明人： Ming-Da Cheng , Hsiu-Jen Lin , Cheng-Ting Chen , Wei-Yu Chen , Chien-Wei Lee , Chung-Shi Liu
IPC分类号： H01L21/683 , H01L21/677 , H01L23/00 , B23K3/08
CPC分类号： H05B3/02 , B23K3/087 , B23K2101/40 , H01L21/67721 , H01L21/6838 , H01L24/75 , H01L24/81 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/75744 , H01L2224/7598 , H01L2224/81191 , H01L2224/81815 , H01L2224/97 , H01L2924/3511 , H01L2924/37001 , H01L2924/00014 , H01L2224/81 , H01L2924/014
摘要： A method includes placing a first package component over a vacuum boat, wherein the vacuum boat comprises a hole, and wherein the first package component covers the hole. A second package component is placed over the first package component, wherein solder regions are disposed between the first and the second package components. The hole is vacuumed, wherein the first package component is pressed by a pressure against the vacuum boat, and wherein the pressure is generated by a vacuum in the hole. When the vacuum in the hole is maintained, the solder regions are reflowed to bond the second package component to the first package component.
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公开(公告)号：US09373603B2
公开(公告)日：2016-06-21
申请号：US14194057
申请日：2014-02-28
发明人： Ai-Tee Ang , Hsiu-Jen Lin , Cheng-Ting Chen , Ming-Da Cheng , Chung-Shi Liu
CPC分类号： H01L24/75 , B23K1/0016 , B23K1/203 , B23K3/04 , B23K3/082 , H01L24/13 , H01L24/16 , H01L24/20 , H01L24/29 , H01L24/32 , H01L24/81 , H01L25/105 , H01L25/50 , H01L2224/12105 , H01L2224/131 , H01L2224/16227 , H01L2224/2101 , H01L2224/2919 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/75101 , H01L2224/75251 , H01L2224/75252 , H01L2224/75283 , H01L2224/755 , H01L2224/7565 , H01L2224/759 , H01L2224/7598 , H01L2224/81065 , H01L2224/81075 , H01L2224/81191 , H01L2224/812 , H01L2224/8121 , H01L2224/8123 , H01L2224/81815 , H01L2224/95 , H01L2924/01007 , H01L2924/15311 , H01L2924/181 , H01L2924/2026 , H01L2924/00 , H01L2924/014 , H01L2224/81 , H01L2924/00012 , H01L2924/00014 , H01L2224/75
摘要： Reflow processes and apparatuses are disclosed. A process includes enclosing a package workpiece in an enclosed environment of a chamber of a reflow tool; causing an oxygen content of the enclosed environment of the chamber to be less than 40 ppm; and performing a reflow process in the enclosed environment of the chamber while the oxygen content is less than 40 ppm. An apparatus includes a reflow chamber, a door to the reflow chamber, an energy source in the reflow chamber, and gas supply equipment coupled to the chamber. The door is operable to enclose an environment in the reflow chamber. The energy source is operable to increase a temperature in the environment in the reflow chamber. The gas supply equipment is operable to provide a gas to the reflow chamber.
摘要翻译： 公开了回流处理和装置。 一种方法包括将包装工件封闭在回流工具的室的封闭环境中; 导致室的封闭环境的氧含量小于40ppm; 并且在氧气含量小于40ppm时，在室的封闭环境中进行回流处理。 一种装置包括回流室，回流室的门，回流室中的能量源，以及耦合到该室的气体供应设备。 门可操作以将环境包围在回流室中。 能量源可操作以增加回流室中环境中的温度。 气体供应设备可操作以向回流室提供气体。
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公开(公告)号：US09355927B2
公开(公告)日：2016-05-31
申请号：US14088513
申请日：2013-11-25
发明人： Hsiu-Jen Lin , Wen-Hsiung Lu , Cheng-Ting Chen , Hsuan-Ting Kuo , Wei-Yu Chen , Ming-Da Cheng , Chung-Shi Liu
IPC分类号： H01L23/488 , H01L23/31 , H01L23/00 , H01L23/498 , H05K3/34 , H01L21/56
CPC分类号： H01L23/49816 , H01L21/563 , H01L23/3114 , H01L23/49838 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/92 , H01L2224/02377 , H01L2224/02379 , H01L2224/0239 , H01L2224/0382 , H01L2224/03829 , H01L2224/03849 , H01L2224/0391 , H01L2224/0401 , H01L2224/05024 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05184 , H01L2224/05568 , H01L2224/05794 , H01L2224/05811 , H01L2224/10125 , H01L2224/11005 , H01L2224/11334 , H01L2224/119 , H01L2224/1191 , H01L2224/13006 , H01L2224/13014 , H01L2224/13017 , H01L2224/13018 , H01L2224/13022 , H01L2224/13023 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13117 , H01L2224/1312 , H01L2224/13139 , H01L2224/13147 , H01L2224/13155 , H01L2224/14131 , H01L2224/16058 , H01L2224/16145 , H01L2224/16227 , H01L2224/2919 , H01L2224/32058 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81191 , H01L2224/81192 , H01L2224/812 , H01L2224/8121 , H01L2224/8123 , H01L2224/81815 , H01L2224/9212 , H01L2924/0105 , H01L2924/014 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/20105 , H01L2924/20106 , H01L2924/351 , H05K1/111 , H05K3/34 , H01L2924/00 , H01L2924/01047 , H01L2924/01029 , H01L2924/00014 , H01L2924/01032 , H01L2924/01051 , H01L2924/01083 , H01L2924/01084 , H01L2924/01031 , H01L2924/01049 , H01L2924/01081 , H01L2924/00012 , H01L2924/01082 , H01L2924/01013 , H01L2924/01079 , H01L2924/01028 , H01L2924/01074
摘要： The present disclosure provides a semiconductor package includes a contact pad, a device external to the contact pad and a solder bump on the contact pad. The device has a conductive contact pad corresponding to the contact pad. The solder bump connects the contact pad with the conductive contact pad. The solder bump comprises a height from a top of the solder bump to the contact pad; and a width which is a widest dimension of the solder bump in a direction perpendicular to the height. A junction portion of the solder bump in proximity to the contact pad comprises an hourglass shape.
摘要翻译： 本公开提供一种半导体封装，其包括接触焊盘，接触焊盘外部的器件和接触焊盘上的焊料凸块。 该器件具有对应于接触焊盘的导电接触焊盘。 焊锡凸块将接触焊盘与导电接触焊盘连接。 焊料凸块包括从焊料凸块的顶部到接触垫的高度; 以及在垂直于高度的方向上的焊料凸块的最宽尺寸的宽度。 靠近接触垫的焊料凸块的接合部分包括沙漏形状。
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公开(公告)号：US20150108638A1
公开(公告)日：2015-04-23
申请号：US14557227
申请日：2014-12-01
发明人： Chun-Cheng Lin , Hsiu-Jen Lin , Cheng-Ting Chen , Wei-Yu Chen , Ming-Da Cheng , Chung-Shi Liu
CPC分类号： H01L24/16 , H01L23/49816 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/17 , H01L24/48 , H01L24/81 , H01L24/94 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L25/074 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/056 , H01L2224/05611 , H01L2224/05616 , H01L2224/06181 , H01L2224/111 , H01L2224/11334 , H01L2224/11849 , H01L2224/131 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13139 , H01L2224/13147 , H01L2224/13155 , H01L2224/13216 , H01L2224/13224 , H01L2224/13239 , H01L2224/13244 , H01L2224/13247 , H01L2224/13255 , H01L2224/13284 , H01L2224/13309 , H01L2224/13317 , H01L2224/13318 , H01L2224/1332 , H01L2224/13338 , H01L2224/13349 , H01L2224/13355 , H01L2224/1336 , H01L2224/13366 , H01L2224/137 , H01L2224/13809 , H01L2224/13817 , H01L2224/13818 , H01L2224/1382 , H01L2224/13838 , H01L2224/13849 , H01L2224/13855 , H01L2224/1386 , H01L2224/13866 , H01L2224/14181 , H01L2224/1601 , H01L2224/16145 , H01L2224/16148 , H01L2224/16225 , H01L2224/16506 , H01L2224/1703 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/73265 , H01L2224/81191 , H01L2224/81193 , H01L2224/81815 , H01L2224/94 , H01L2224/96 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06541 , H01L2225/06565 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01322 , H01L2924/1305 , H01L2924/13091 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/384 , H05K3/3436 , H05K3/4015 , H05K2201/10515 , Y02P70/613 , H01L2224/81 , H01L2924/00 , H01L2924/014 , H01L2924/01032 , H01L2924/01015 , H01L2924/01058 , H01L2924/00012 , H01L2924/0105 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package on package structure includes a first substrate having a first region and a second region, a bump formed on the first region of the first substrate, a first semiconductor die bonded to the second region of the first substrate, and a semiconductor die package bonded to the first substrate. The bump includes a metallic structure and a plurality of minor elements dispersed in the metallic structure. The semiconductor die package includes a connector bonded to the bump, and the first semiconductor die is between the semiconductor die package and the first substrate.
摘要翻译： 封装结构包括具有第一区域和第二区域的第一基板，形成在第一基板的第一区域上的凸块，与第一基板的第二区域接合的第一半导体管芯，以及半导体管芯封装 到第一底物。 凸块包括分散在金属结构中的金属结构和多个次要元件。 半导体管芯封装包括接合到凸块的连接器，并且第一半导体管芯位于半导体管芯封装和第一衬底之间。
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公开(公告)号：US08901726B2
公开(公告)日：2014-12-02
申请号：US13708461
申请日：2012-12-07
发明人： Chun-Cheng Lin , Hsiu-Jen Lin , Cheng-Ting Chen , Wei-Yu Chen , Ming-Da Cheng , Chung-Shi Liu
IPC分类号： H01L23/02 , H01L25/10 , H01L23/00 , H01L25/00 , H01L23/498 , H01L25/065
CPC分类号： H01L24/16 , H01L23/49816 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/17 , H01L24/48 , H01L24/81 , H01L24/94 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L25/074 , H01L25/105 , H01L25/50 , H01L2224/0401 , H01L2224/056 , H01L2224/05611 , H01L2224/05616 , H01L2224/06181 , H01L2224/111 , H01L2224/11334 , H01L2224/11849 , H01L2224/131 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13139 , H01L2224/13147 , H01L2224/13155 , H01L2224/13216 , H01L2224/13224 , H01L2224/13239 , H01L2224/13244 , H01L2224/13247 , H01L2224/13255 , H01L2224/13284 , H01L2224/13309 , H01L2224/13317 , H01L2224/13318 , H01L2224/1332 , H01L2224/13338 , H01L2224/13349 , H01L2224/13355 , H01L2224/1336 , H01L2224/13366 , H01L2224/137 , H01L2224/13809 , H01L2224/13817 , H01L2224/13818 , H01L2224/1382 , H01L2224/13838 , H01L2224/13849 , H01L2224/13855 , H01L2224/1386 , H01L2224/13866 , H01L2224/14181 , H01L2224/1601 , H01L2224/16145 , H01L2224/16148 , H01L2224/16225 , H01L2224/16506 , H01L2224/1703 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/73265 , H01L2224/81191 , H01L2224/81193 , H01L2224/81815 , H01L2224/94 , H01L2224/96 , H01L2224/97 , H01L2225/0651 , H01L2225/06513 , H01L2225/06541 , H01L2225/06565 , H01L2225/06568 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01322 , H01L2924/1305 , H01L2924/13091 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/384 , H05K3/3436 , H05K3/4015 , H05K2201/10515 , Y02P70/613 , H01L2224/81 , H01L2924/00 , H01L2924/014 , H01L2924/01032 , H01L2924/01015 , H01L2924/01058 , H01L2924/00012 , H01L2924/0105 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A package on package structure includes a first substrate having a first region and a second region, a bump formed on the first region of the first substrate, a first semiconductor die bonded to the second region of the first substrate, and a semiconductor die package bonded to the first substrate. The bump includes a metallic structure and a plurality of minor elements dispersed in the metallic structure. The semiconductor die package includes a connector bonded to the bump, and the first semiconductor die is between the semiconductor die package and the first substrate.
摘要翻译： 封装结构包括具有第一区域和第二区域的第一基板，形成在第一基板的第一区域上的凸块，与第一基板的第二区域接合的第一半导体管芯，以及半导体管芯封装 到第一底物。 凸块包括分散在金属结构中的金属结构和多个次要元件。 半导体管芯封装包括接合到凸块的连接器，并且第一半导体管芯位于半导体管芯封装和第一衬底之间。
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公开(公告)号：US20140231125A1
公开(公告)日：2014-08-21
申请号：US13913599
申请日：2013-06-10
发明人： Cheng-Ting Chen , Hsuan-Ting Kuo , Hsien-Wei Chen , Wen-Hsiung Lu , Ming-Da Cheng , Chung-Shi Liu
CPC分类号： H05K3/281 , H01L21/566 , H01L23/3192 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0345 , H01L2224/0401 , H01L2224/05548 , H01L2224/05567 , H01L2224/05569 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05681 , H01L2224/05684 , H01L2224/1134 , H01L2224/11849 , H01L2224/1191 , H01L2224/13006 , H01L2224/13022 , H01L2224/13023 , H01L2224/13024 , H01L2224/131 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13184 , H01L2224/1329 , H01L2224/133 , H01L2224/16238 , H01L2224/73204 , H01L2224/81191 , H01L2224/81815 , H05K3/4007 , Y10T29/49147 , H01L2924/00014 , H01L2924/014
摘要： Disclosed herein is a mechanism for forming an interconnect comprising forming a connector on an interconnect disposed on a first surface of a first substrate and applying a nonconductive material in a non-liquid form over the interconnect after forming the connector. The nonconductive material covers at least a lower portion of the interconnect, and at least a portion of the interconnect is exposed. The nonconductive material is formed around the connector by pressing the nonconductive material over the connector with a roller. An angle between a top surface of the nonconductive material and a connector sidewall between about 65 degrees and about 135 degrees. The nonconductive material may be formed to extend under the connector.
摘要翻译： 本文公开了一种用于形成互连的机构，包括在布置在第一基板的第一表面上的互连上形成连接器，并且在形成连接器之后在互连上以非液体形式施加非导电材料。 非导电材料覆盖互连的至少下部，并且互连的至少一部分被暴露。 通过用辊将不导电材料压在连接器上而形成在连接器周围的非导电材料。 非导电材料的顶表面与约65度至约135度之间的连接器侧壁之间的角度。 非导电材料可以形成为在连接器下方延伸。
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公开(公告)号：US20140187103A1
公开(公告)日：2014-07-03
申请号：US13751289
申请日：2013-01-28
发明人： Cheng-Ting Chen , Wen-Hsiung Lu , Ming-Da Cheng , Chung-Shi Liu , Mirng-Ji Lii
CPC分类号： H01L24/16 , H01L23/3114 , H01L23/3142 , H01L23/3157 , H01L23/49816 , H01L24/08 , H01L24/11 , H01L24/13 , H01L24/81 , H01L25/0657 , H01L2224/0345 , H01L2224/0401 , H01L2224/05548 , H01L2224/05567 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05681 , H01L2224/05684 , H01L2224/08238 , H01L2224/11334 , H01L2224/1181 , H01L2224/11849 , H01L2224/119 , H01L2224/1191 , H01L2224/13005 , H01L2224/13007 , H01L2224/13016 , H01L2224/13022 , H01L2224/13024 , H01L2224/131 , H01L2224/13111 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13184 , H01L2224/1329 , H01L2224/133 , H01L2224/1601 , H01L2224/16052 , H01L2224/16112 , H01L2224/16113 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/81024 , H01L2224/81191 , H01L2224/81815 , H01L2225/06513 , H01L2924/181 , H01L2924/18161 , H01L2924/20641 , H01L2924/20642 , H01R43/0235 , H01L2924/207 , H01L2924/00014 , H01L2924/00012 , H01L2924/014 , H01L2924/01047 , H01L2924/01029 , H01L2924/00
摘要： Presented herein are an interconnect and method for forming the same, the method comprising forming an interconnect on a mounting surface of a mounting pad disposed on a first surface of a first substrate, the interconnect comprising a conductive material, optionally solder or metal, the interconnect avoiding the sides of the mounting pad. A molding compound is applied to the first surface of the first substrate and molded around the interconnect to covering at least a lower portion of the interconnect and a second substrate may be mounted on the interconnect. The interconnect may comprise an interconnect material disposed between a first and second substrate and a molding compound disposed on a surface of the first substrate, and exposing a portion of the interconnect. A sidewall of the interconnect material contacts the mounting pad at an angle less than about 30 degrees from a plane perpendicular to the first substrate.
摘要翻译： 这里提出了一种用于形成它的互连和方法，所述方法包括在设置在第一基板的第一表面上的安装焊盘的安装表面上形成互连，所述互连包括导电材料，可选地焊料或金属，所述互连 避免安装垫的侧面。 将模塑料施加到第一基板的第一表面并且在互连件周围模制以覆盖互连件的至少下部，并且第二基板可以安装在互连件上。 互连可以包括设置在第一和第二基板之间的互连材料和设置在第一基板的表面上的模制化合物，以及暴露互连的一部分。 互连材料的侧壁以与垂直于第一衬底的平面成小于约30度的角度接触安装衬垫。
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公开(公告)号：US11996400B2
公开(公告)日：2024-05-28
申请号：US17731240
申请日：2022-04-27
发明人： Hsuan-Ting Kuo , Ching-Hua Hsieh , Cheng-Ting Chen , Hsiu-Jen Lin , Hao-Jan Pei , Yu-Peng Tsai , Chia-Lun Chang , Chih-Chiang Tsao , Philip Yu-Shuan Chung
IPC分类号： H01L25/10 , H01L21/56 , H01L21/683 , H01L21/768 , H01L23/00 , H01L23/31 , H01L23/522 , H01L25/00 , H01L27/06
CPC分类号： H01L25/50 , H01L21/56 , H01L21/6836 , H01L21/76871 , H01L23/3128 , H01L23/5226 , H01L24/17 , H01L24/33 , H01L27/0688 , H01L2224/02372 , H01L2224/02373
摘要： A manufacturing method of a package-on-package structure includes at least the following steps. Top packages are mounted on a top side of a reconstructed wafer over a flexible tape, where conductive bumps at a bottom side of the reconstructed wafer is attached to the flexible tape, and during the mounting, a shape geometry of the respective conductive bump changes and at least a lower portion of the respective conductive bump is embraced by the flexible tape. The flexible tape is released from the conductive bumps after the mounting.
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公开(公告)号：US20230014450A1
公开(公告)日：2023-01-19
申请号：US17377387
申请日：2021-07-16
发明人： Jen-Jui Yu , Ching-Hua Hsieh , Cheng-Ting Chen , Hsiu-Jen Lin , Wei-Yu Chen , Chih-Chiang Tsao , Chao-Wei Chiu
IPC分类号： H01L23/00 , H01L21/48 , H01L25/16 , H01L21/683
摘要： A package structure and a method of forming the same are provided. The package structure includes a die, an encapsulant, a redistribution layer (RDL) structure, a passive device, and a plurality of dummy items. The encapsulant laterally encapsulates the die. The RDL structure is disposed on the die and the encapsulant. The passive device is disposed on and electrically bonded to the RDL structure. The plurality of dummy items are disposed on the RDL structure and laterally aside the passive device, wherein top surfaces of the plurality of dummy items are higher than a top surface of the passive device.
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