Invention Application
- Patent Title: Photo-Sensitive Silicon Package Embedding Self-Powered Electronic System
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Application No.: US15820246Application Date: 2017-11-21
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Publication No.: US20180096978A1Publication Date: 2018-04-05
- Inventor: Osvaldo Jorge Lopez , Walter Hans Paul Schroen , Jonathan Almeria Noquil , Thomas Eugene Grebs , Simon John Molloy
- Applicant: Texas Instruments Incorporated
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01L25/00 ; H01L27/088 ; H01L27/082 ; H01L31/18 ; H01L31/042 ; H01L31/028 ; H01L31/0216 ; H01L31/02

Abstract:
A self-powered electronic system comprises a first chip (401) of single-crystalline semiconductor embedded in a second chip (302) of single-crystalline semiconductor shaped as a container bordered by ridges. The assembled chips are nested and form an electronic device assembled, in turn, in a slab of weakly p-doped low-grade silicon shaped as a container (330) bordered by ridges (331). The flat side (335) of the slab includes a heavily n-doped region (314) forming a pn-junction (315) with the p-type bulk. A metal-filled deep silicon via (350) through the p-type ridge (331) connects the n-region with the terminal (322) on the ridge surface as cathode of the photovoltaic cell with the p-region as anode. The voltage across the pn-junction serves as power source of the device.
Public/Granted literature
- US10438936B2 Photo-sensitive silicon package embedding self-powered electronic system Public/Granted day:2019-10-08
Information query
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