- 专利标题： ELECTRONIC DEVICES WITH COMPONENTS FORMED BY LATE BINDING USING SELF-ASSEMBLED MONOLAYERS
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申请号： US15476842申请日： 2017-03-31
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公开(公告)号： US20180286687A1公开(公告)日： 2018-10-04
- 发明人: Sasha N. OSTER , Fay HUA , Telesphor KAMGAING , Adel A. ELSHERBINI , Henning BRAUNISCH , Johanna M. SWAN
- 申请人： INTEL CORPORATION
- 主分类号： H01L21/285
- IPC分类号： H01L21/285 ; H01L21/768 ; H01L21/033 ; G03F7/16 ; B82Y40/00
摘要：
Embodiments include devices and methods, including a method for processing a substrate. The method includes providing a substrate including a first portion and a second portion, the first portion including a feature, the feature including an electrically conductive region, the second portion including a dielectric surface region. The method also includes performing self-assembled monolayer (SAM) assisted structuring plating to form a structure comprising a metal on the dielectric surface region, the feature being formed using a process other than the SAM assisted structuring plating used to form the structure, and the structure being formed after the feature. Other embodiments are described and claimed.
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