公开(公告)号：US20210194966A1

公开(公告)日：2021-06-24

申请号：US16757751

申请日：2017-12-30

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Adel A. ELSHERBINI ,  Erich N. EWY ,  Johanna M. SWAN ,  Telesphor KAMGAING

IPC: H04L29/08 ,  H01P3/08 ,  H04L5/14 ,  G08C23/06 ,  H04B1/3822 ,  B60R16/023 ,  B60R16/03

Abstract: Embodiments include a sensor node, an active sensor node, and a vehicle with a communication system that includes sensor nodes. The sensor node include a package substrate, a diplexer/combiner block on the package substrate, a transceiver communicatively coupled to the diplexer/combiner block, and a first mm-wave launcher coupled to the diplexer/combiner block. The sensor node may have a sensor communicatively coupled to the transceiver, the sensor is communicatively coupled to the transceiver by an electrical cable and located on the package substrate. The sensor node may include that the sensor operates at a frequency band for communicating with an electronic control unit (ECU) communicatively coupled to the sensor node. The sensor node may have a filter communicatively coupled to the diplexer/combiner block, the transceiver communicatively coupled to the filter, the filter substantially removes frequencies from RF signals other than the frequency band of the sensor.

公开(公告)号：US20190297975A1

公开(公告)日：2019-10-03

申请号：US16303386

申请日：2016-07-02

Applicant: Intel Corporation

Inventor： Aleksandar ALEKSOV ,  Sasha N. OSTER ,  Feras EID ,  Shawna M. LIFF ,  Thomas L. SOUNART ,  Johanna M. SWAN ,  Baris BICEN ,  Valluri R. RAO

IPC: A41D27/28 ,  A41D13/00 ,  A41D27/24 ,  A61M35/00 ,  A61M5/145

Abstract: Embodiments of the invention include an active venting system. According to an embodiment of the invention, the active venting system may include a substrate having one or more seams formed through the substrate. In order to open the vents defined by the seams through the substrate, a piezoelectric layer may be formed proximate to one or more of the seams. Additional embodiments may include a first electrode and a second electrode that contact the piezoelectric layer in order to provide a voltage differential across the piezoelectric layer. In an embodiment the active venting system may be integrated into a garment. In such an embodiment, the garment may also include an electronics module for controlling the actuators. Additionally, conductive traces may be printed on the garment or sewn into the garment to provide electrical connections from the electronics module to each of the piezoelectric actuators.

公开(公告)号：US20190141456A1

公开(公告)日：2019-05-09

申请号：US16096568

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Feras EID ,  Adel A. ELSHERBINI ,  Johanna SWAN ,  Shawna M. LIFF ,  Thomas L. SOUNART ,  Sasha N. OSTER

IPC: H04R17/00 ,  B06B1/06

CPC classification number: H04R17/005 ,  B06B1/0622 ,  B06B1/0625 ,  B06B1/0644 ,  H04R2201/028

Abstract: Embodiments of the invention include an acoustic transducer device having a base structure that is positioned in proximity to a cavity of an organic substrate, a piezoelectric material in contact with a first electrode of the base structure, and a second electrode in contact with the piezoelectric material. In one example, for a transmit mode, a voltage signal is applied between the first and second electrodes and this causes a stress in the piezoelectric material which causes a stack that is formed with the first electrode, the piezoelectric material, and the second electrode to vibrate and hence the base structure to vibrate and generate acoustic waves.

公开(公告)号：US20180003677A1

公开(公告)日：2018-01-04

申请号：US15199901

申请日：2016-06-30

Applicant: Intel Corporation

Inventor： Sasha N. OSTER ,  Feras EID ,  Georgios C. DOGIAMIS ,  Thomas L. SOUNART ,  Adel A. ELSHERBINI ,  Johanna M. SWAN ,  Shawna M. LIFF

IPC: G01N29/02 ,  B81B3/00 ,  G01N33/00 ,  G01N33/543 ,  G01N33/22 ,  G01N29/036

CPC classification number: G01N29/022 ,  B81B3/0021 ,  B81B2201/0214 ,  G01N29/036 ,  G01N29/2437 ,  G01N33/0047 ,  G01N33/227 ,  G01N33/54373 ,  G01N2291/0255 ,  G01N2291/0256 ,  G01N2291/0423

Abstract: Embodiments of the invention include a chemical species-sensitive device that includes an input transducer to receive input signals, a base structure that is coupled to the input transducer and positioned in proximity to a cavity of an organic substrate, a chemically sensitive functionalization material attached to the base structure, and an output transducer to generate output signals. For a chemical sensing functionality, a desired chemical species attaches to the chemically sensitive functionalization material which causes a change in mass of the base structure and this change in mass causes a change in a mechanical resonant frequency of the chemical species-sensitive device.

公开(公告)号：US20230246338A1

公开(公告)日：2023-08-03

申请号：US18133361

申请日：2023-04-11

Applicant: Intel Corporation

Inventor： Feras EID ,  Sasha N. OSTER ,  Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Aleksandar ALEKSOV

IPC: H01Q9/04 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/52 ,  H01Q19/22

CPC classification number: H01Q9/0414 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/2283 ,  H01Q1/241 ,  H01Q1/526 ,  H01Q19/22 ,  H01L23/3675

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

公开(公告)号：US20210265732A1

公开(公告)日：2021-08-26

申请号：US17317332

申请日：2021-05-11

Applicant: Intel Corporation

Inventor： Feras EID ,  Sasha N. OSTER ,  Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Aleksandar ALEKSOV

IPC: H01Q9/04 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/52 ,  H01Q19/22

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

公开(公告)号：US20200060558A1

公开(公告)日：2020-02-27

申请号：US16304070

申请日：2016-07-02

Applicant: Intel Corporation

Inventor： Aleksandar ALEKSOV ,  Feras EID ,  Sasha N. OSTER ,  Adel ELSHERBINI ,  Johanna M. SWAN

IPC: A61B5/021 ,  A61B5/0408 ,  A61B5/00 ,  A61B5/11 ,  H01L41/08 ,  H01L41/316 ,  H01L41/317

Abstract: Embodiments of the invention include a wearable blood-pressure monitor and methods of forming such devices. In an embodiment, the blood-pressure monitor includes a stretchable substrate. Additionally, a semiconductor die may be embedded within the stretchable substrate. In order to determine blood-pressure, the blood-pressure monitor may include an electrocardiogram sensor and a piezoelectric sensor for detecting a ballistocardiograph response. In an embodiment, both types of sensor may be electrically coupled to the semiconductor die. Embodiments of the invention include a piezoelectric sensor that includes a piezoelectric layer and a first and second electrode. In an embodiment the first electrode is in contact with a first surface of the piezoelectric layer, and the second electrode is in contact with a second surface of the piezoelectric layer that is opposite to the first surface.

公开(公告)号：US20190326213A1

公开(公告)日：2019-10-24

申请号：US16464972

申请日：2016-12-30

Applicant: INTEL CORPORATION

Inventor： Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Sasha N. OSTER

IPC: H01L23/522 ,  H01G4/33 ,  H01G4/38 ,  H01L23/488 ,  H01L23/50 ,  H01L23/64 ,  H05K1/16 ,  H01L49/02 ,  H01L23/00

Abstract: Embodiments of the invention include a microelectronic device that includes a substrate having transistor layers and interconnect layers including conductive layers to form connections to transistor layers. A capacitive bump is disposed on the interconnect layers. The capacitive bump includes a first electrode, a dielectric layer, and a second electrode. In another example, an inductive bump is disposed on the interconnect layers. The inductive bump includes a conductor and a magnetic layer that surrounds the conductor.

公开(公告)号：US20190288371A1

公开(公告)日：2019-09-19

申请号：US16345173

申请日：2016-12-20

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Sasha N. OSTER

IPC: H01Q1/22 ,  H01L23/66 ,  H01L23/31 ,  H01L23/538 ,  H01L25/065 ,  H01Q1/38

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) circuits and a second substrate coupled to the first substrate. The second substrate includes a first section and a second section with the second substrate being foldable in order to obtain a desired orientation of an antenna unit of the second section for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US20190025573A1

公开(公告)日：2019-01-24

申请号：US16072164

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Aleksandar ALEKSOV ,  Feras EID ,  Sasha N. OSTER ,  Shawna M. LIFF ,  Johanna M. SWAN ,  Thomas L. SOUNART ,  Baris BICEN ,  Valluri R. RAO

IPC: G02B26/10 ,  G02B26/08

Abstract: Embodiments of the invention include maskless imaging tools and display systems that include piezoelectrically actuated mirrors and methods of forming such devices. According to an embodiment, the maskless imaging tool may include a light source. Additionally, the tool may include one or more piezoelectrically actuated mirrors for receiving light from the light source. In an embodiment, the piezoelectrically actuated mirrors are actuatable about one or more axes to reflect the light from the light source to a workpiece positioned to receive light from the piezoelectrically actuated mirror. Additional embodiments of the invention may include a maskless imaging tool that is a laser direct imaging lithography (LDIL) tool. Other embodiments may include a maskless imaging tool that is a via-drill tool. Embodiments of the invention may also include a piezoelectrically actuated mirror used in a projection system. For example, the projection system may be integrated into a pair of glasses.