公开(公告)号：US20240038671A1

公开(公告)日：2024-02-01

申请号：US18377991

申请日：2023-10-09

Applicant: Intel Corporation

Inventor： Henning BRAUNISCH ,  Chia-Pin CHIU ,  Aleksandar ALEKSOV ,  Hinmeng AU ,  Stefanie M. LOTZ ,  Johanna M. SWAN ,  Sujit SHARAN

IPC: H01L23/538 ,  H01L23/13 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/5385 ,  H01L23/5381 ,  H01L23/13 ,  H01L24/14 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/0657 ,  H01L21/6835

Abstract: A multi-chip package includes a substrate (110) having a first side (111), an opposing second side (112), and a third side (213) that extends from the first side to the second side, a first die (120) attached to the first side of the substrate and a second die (130) attached to the first side of the substrate, and a bridge (140) adjacent to the third side of the substrate and attached to the first die and to the second die. No portion of the substrate is underneath the bridge. The bridge creates a connection between the first die and the second die. Alternatively, the bridge may be disposed in a cavity (615, 915) in the substrate or between the substrate and a die layer (750). The bridge may constitute an active die and may be attached to the substrate using wirebonds (241, 841, 1141, 1541).

公开(公告)号：US20230088545A1

公开(公告)日：2023-03-23

申请号：US17992771

申请日：2022-11-22

Applicant: Intel Corporation

Inventor： Georgios DOGIAMIS ,  Johanna M. SWAN

IPC: H01L23/538 ,  H01L25/065 ,  H01L23/66 ,  H01P3/12 ,  H01P5/12

Abstract: Disclosed herein are waveguide interconnect bridges for integrated circuit (IC) structures, as well as related methods and devices. In some embodiments, a waveguide interconnect bridge may include a waveguide material and one or more wall cavities in the waveguide material. The waveguide interconnect bridge may communicatively couple two dies in an IC package.

公开(公告)号：US20200219861A1

公开(公告)日：2020-07-09

申请号：US16647451

申请日：2017-12-28

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Vijay K. NAIR ,  Feras EID ,  Georgios C. DOGIAMIS ,  Johanna M. SWAN ,  Stephan LEUSCHNER

IPC: H01L25/16 ,  H01L23/498 ,  H01L23/24 ,  H03H9/17 ,  H03H9/05

Abstract: RF front end systems or modules with an acoustic wave resonator (AWR) on an interposer substrate are described. In an example, an integrated system includes an active die, the active die comprising a semiconductor substrate having a plurality of active circuits therein. An interposer is also included, the interposer comprising an acoustic wave resonator (AWR). A seal frame couples the active die to the interposer, the seal frame surrounding the acoustic wave resonator and hermetically sealing the acoustic wave resonator between the active die and the interposer.

公开(公告)号：US20200168402A1

公开(公告)日：2020-05-28

申请号：US16605968

申请日：2017-06-27

Applicant: Intel Corporation

Inventor： Feras EID ,  Aleksandar ALEKSOV ,  Georgios C. DOGIAMIS ,  Thomas L. SOUNART ,  Johanna M. SWAN

IPC: H01G5/16 ,  H01G5/14 ,  H01L23/00

Abstract: Embodiments of the invention include a microelectronic device that includes a plurality of organic dielectric layers and a piezoelectrically actuated tunable capacitor having a variable capacitance formed in-situ with at least one organic dielectric layer of the plurality of organic dielectric layers. A piezoelectric actuator of the tunable capacitor includes first and second conductive electrodes and a piezoelectric layer that is positioned between the first and second conductive electrodes.

公开(公告)号：US20200060558A1

公开(公告)日：2020-02-27

申请号：US16304070

申请日：2016-07-02

Applicant: Intel Corporation

Inventor： Aleksandar ALEKSOV ,  Feras EID ,  Sasha N. OSTER ,  Adel ELSHERBINI ,  Johanna M. SWAN

IPC: A61B5/021 ,  A61B5/0408 ,  A61B5/00 ,  A61B5/11 ,  H01L41/08 ,  H01L41/316 ,  H01L41/317

Abstract: Embodiments of the invention include a wearable blood-pressure monitor and methods of forming such devices. In an embodiment, the blood-pressure monitor includes a stretchable substrate. Additionally, a semiconductor die may be embedded within the stretchable substrate. In order to determine blood-pressure, the blood-pressure monitor may include an electrocardiogram sensor and a piezoelectric sensor for detecting a ballistocardiograph response. In an embodiment, both types of sensor may be electrically coupled to the semiconductor die. Embodiments of the invention include a piezoelectric sensor that includes a piezoelectric layer and a first and second electrode. In an embodiment the first electrode is in contact with a first surface of the piezoelectric layer, and the second electrode is in contact with a second surface of the piezoelectric layer that is opposite to the first surface.

公开(公告)号：US20190187798A1

公开(公告)日：2019-06-20

申请号：US16326902

申请日：2016-10-01

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Aleksandar ALEKSOV ,  Johanna M. SWAN

IPC: G06F3/01 ,  G06F1/16

CPC classification number: G06F3/016 ,  G06F1/16 ,  G06F1/163

Abstract: In accordance with disclosed embodiments, there are provided systems, methods, and apparatuses for implementing increased human perception of haptic feedback systems. For instance, there is disclosed in accordance with one embodiment there is wearable device, having therein: a wearable device case; a plurality of actuators within the wearable device case, each of which to vibrate independently or in combination; in which one surface of each of the plurality of actuators is exposed at a surface of the wearable device case; an elastomer surrounding the sides of each of the plurality of actuators within the wearable device case to hold the actuators in position within the wearable device case; and electrical interconnects from each of the plurality of actuators to internal semiconductor components of the wearable device. Other related embodiments are disclosed.

公开(公告)号：US20190025573A1

公开(公告)日：2019-01-24

申请号：US16072164

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Aleksandar ALEKSOV ,  Feras EID ,  Sasha N. OSTER ,  Shawna M. LIFF ,  Johanna M. SWAN ,  Thomas L. SOUNART ,  Baris BICEN ,  Valluri R. RAO

IPC: G02B26/10 ,  G02B26/08

Abstract: Embodiments of the invention include maskless imaging tools and display systems that include piezoelectrically actuated mirrors and methods of forming such devices. According to an embodiment, the maskless imaging tool may include a light source. Additionally, the tool may include one or more piezoelectrically actuated mirrors for receiving light from the light source. In an embodiment, the piezoelectrically actuated mirrors are actuatable about one or more axes to reflect the light from the light source to a workpiece positioned to receive light from the piezoelectrically actuated mirror. Additional embodiments of the invention may include a maskless imaging tool that is a laser direct imaging lithography (LDIL) tool. Other embodiments may include a maskless imaging tool that is a via-drill tool. Embodiments of the invention may also include a piezoelectrically actuated mirror used in a projection system. For example, the projection system may be integrated into a pair of glasses.

公开(公告)号：US20180097284A1

公开(公告)日：2018-04-05

申请号：US15283140

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Shawna M. LIFF ,  Adel A. ELSHERBINI ,  Sasha N. OSTER ,  Feras EID ,  Georgios C. DOGIAMIS ,  Thomas L. SOUNART ,  Johanna M. SWAN

IPC: H01Q1/52 ,  H01L41/09 ,  H01L41/047 ,  H01L41/187 ,  H01L41/04 ,  H01Q5/50 ,  H04L29/06

CPC classification number: H01Q1/526 ,  H01L41/047 ,  H01L41/094 ,  H01Q1/273 ,  H01Q15/0086 ,  H04L63/0245 ,  H04L63/1475 ,  H04L67/12 ,  H04L67/146 ,  H04W12/0052 ,  H04W12/12

Abstract: Embodiments of the invention include a reconfigurable communication system, that includes a substrate and a metamaterial shield formed over the substrate. In an embodiment, the metamaterial shield surrounds one or more components on the substrate. Additionally, a plurality of first piezoelectric actuators may be formed on the substrate. The first piezoelectric actuators may be configured to deform the metamaterial shield and change a frequency band that is permitted to pass through the metamaterial shield. Embodiments may also include a reconfigurable antenna that includes a metamaterial. In an embodiment, a plurality of second piezoelectric actuators may be configured to deform the metamaterial of the antenna and change a central operating frequency of the antenna. Embodiments may also include an integrated circuit electrically coupled to the plurality of first piezoelectric actuators and second piezoelectric actuators.

公开(公告)号：US20170288724A1

公开(公告)日：2017-10-05

申请号：US15088996

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Feras EID ,  Adel A. ELSHERBINI ,  Georgios C. DOGIAMIS ,  Vijay K. NAIR ,  Johanna M. SWAN ,  Valluri R. RAO

IPC: H04B1/48 ,  H03H9/05 ,  H03H9/54 ,  H01H57/00

CPC classification number: H04B1/48 ,  H01H57/00 ,  H01H2057/006 ,  H03H7/38 ,  H03H2015/005

Abstract: Embodiments of the invention include a tunable radio frequency (RF) communication module that includes a transmitting component having at least one tunable component and a receiving component having at least one tunable component. The tunable RF communication module includes at least one piezoelectric switching device coupled to at least one of the transmitting and receiving components. The at least one piezoelectric switching device is formed within an organic substrate having organic material and is designed to tune at least one tunable component of the tunable RF communication module.

公开(公告)号：US20170287808A1

公开(公告)日：2017-10-05

申请号：US15625947

申请日：2017-06-16

Applicant: Intel Corporation

Inventor： Henning BRAUNISCH ,  Feras EID ,  Adel A. ELSHERBINI ,  Johanna M. SWAN ,  Don W. NELSON

IPC: H01L23/498 ,  H01L23/367 ,  H01L21/52 ,  H01L23/473

CPC classification number: H01L23/3675 ,  H01L21/52 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/473 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/5389 ,  H01L2924/0002 ,  H05K1/021 ,  H05K1/185 ,  H05K2201/066 ,  H05K2201/10416 ,  H05K2201/10545 ,  H01L2924/00

Abstract: An apparatus including a die, a first side of the die including a first type of system level contact points and a second side including a second type of contact points; and a package substrate coupled to the die and the second side of the die. An apparatus including a die, a first side of the die including a plurality of system level logic contact points and a second side including a second plurality of system level power contact points. A method including coupling one of a first type of system level contact points on a first side of a die and a second type of system level contact points on a second side of the die to a package substrate.