Invention Application
- Patent Title: SHEET FOR SEMICONDUCTOR PROCESSING
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Application No.: US15764377Application Date: 2016-03-28
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Publication No.: US20180286736A1Publication Date: 2018-10-04
- Inventor: Yasuhiko KAKIUCHI , Takashi AKUTSU , Sayaka BANDOU , Yuichiro KOMASU
- Applicant: LINTEC CORPORATION
- Applicant Address: JP Itabashi-ku
- Assignee: LINTEC CORPORATION
- Current Assignee: LINTEC CORPORATION
- Current Assignee Address: JP Itabashi-ku
- Priority: JP2015-197534 20151005
- International Application: PCT/JP2016/059803 WO 20160328
- Main IPC: H01L21/683
- IPC: H01L21/683 ; C09J7/38 ; C09J7/20
Abstract:
The sheet for semiconductor processing of the present invention includes a base, an unevenness-absorbing layer provided on one surface of the base, and a pressure sensitive adhesive layer provided on the unevenness-absorbing layer, wherein the pressure sensitive adhesive layer is composed of an energy ray-curable pressure sensitive adhesive, and a stress at rupture of the pressure sensitive adhesive layer after energy ray curing is 10 MPa or more.
Public/Granted literature
- US10825711B2 Sheet for semiconductor processing Public/Granted day:2020-11-03
Information query
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