公开(公告)号：US20230064310A1

公开(公告)日：2023-03-02

申请号：US17792575

申请日：2021-01-15

Applicant: LINTEC CORPORATION

Inventor： Yasutaka WATANABE ,  Yasunori KARASAWA ,  Kazue UEMURA ,  Yasuhiko KAKIUCHI

IPC: C08L79/08

Abstract: A resin sheet is made using a resin composition containing a thermosetting component (A). The thermosetting component (A) contains a maleimide resin. A thermal diffusion rate of the thermally cured resin sheet is 1.0 × 10-6 m2/s or more. The resin sheet has a thickness in a range from 5 µm to 120 µm .

公开(公告)号：US20180286736A1

公开(公告)日：2018-10-04

申请号：US15764377

申请日：2016-03-28

Applicant: LINTEC CORPORATION

Inventor： Yasuhiko KAKIUCHI ,  Takashi AKUTSU ,  Sayaka BANDOU ,  Yuichiro KOMASU

IPC: H01L21/683 ,  C09J7/38 ,  C09J7/20

Abstract: The sheet for semiconductor processing of the present invention includes a base, an unevenness-absorbing layer provided on one surface of the base, and a pressure sensitive adhesive layer provided on the unevenness-absorbing layer, wherein the pressure sensitive adhesive layer is composed of an energy ray-curable pressure sensitive adhesive, and a stress at rupture of the pressure sensitive adhesive layer after energy ray curing is 10 MPa or more.