Invention Application
- Patent Title: THERMOELECTRIC DEVICE EMBEDDED IN A PRINTED CIRCUIT BOARD
-
Application No.: US16031868Application Date: 2018-07-10
-
Publication No.: US20180323361A1Publication Date: 2018-11-08
- Inventor: Henry L. Edwards , Kenneth J. Maggio , Steven Kummerl , Sreenivasan K. Koduri
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Main IPC: H01L35/28
- IPC: H01L35/28 ; H01L23/00 ; H05K1/02 ; H01L29/02 ; H05K1/18 ; H01L23/38
Abstract:
A circuit board includes an embedded thermoelectric device with hard thermal bonds. A method includes embedding a thermoelectric device in a circuit board and forming hard thermal bonds.
Information query
IPC分类:
