- 专利标题： ELECTRONIC PACKAGE THAT INCLUDES LAMINATION LAYER
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申请号： US15778042申请日： 2015-11-24
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公开(公告)号： US20180350709A1公开(公告)日： 2018-12-06
- 发明人: Pramod Malatkar , Kyle Yazzie , Naga Sivakumar Yagnamurthy , Richard J. Harries , Dilan Seneviratne , Praneeth Akkinepally , Xuefei Wan , Yonggang Li , Robert L. Sankman
- 申请人： INTEL CORPORATION
- 国际申请： PCT/US2015/062397 WO 20151124
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L23/00 ; H01L23/498 ; H01L25/10
摘要：
An electronic package that includes a substrate and an electronic component attached to the substrate. A laminated layer is attached to an upper surface of the substrate such that the laminated layer covers the electronic component. The electronic package may further include a stiffener mounted on the laminated layer where the stiffener is over the electronic component.
公开/授权文献
- US10985080B2 Electronic package that includes lamination layer 公开/授权日：2021-04-20
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