公开(公告)号：US10985080B2

公开(公告)日：2021-04-20

申请号：US15778042

申请日：2015-11-24

申请人： Intel Corporation

发明人： Pramod Malatkar ,  Kyle Yazzie ,  Naga Sivakumar Yagnamurthy ,  Richard J. Harries ,  Dilan Seneviratne ,  Praneeth Akkinepally ,  Xuefei Wan ,  Yonggang Li ,  Robert L. Sankman

IPC分类号： H01L23/31 ,  H01L23/34 ,  H01L23/48 ,  H01L25/10 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538

摘要： An electronic package that includes a substrate and an electronic component attached to the substrate. A laminated layer is attached to an upper surface of the substrate such that the laminated layer covers the electronic component. The electronic package may further include a stiffener mounted on the laminated layer where the stiffener is over the electronic component.

公开(公告)号：US20180350709A1

公开(公告)日：2018-12-06

申请号：US15778042

申请日：2015-11-24

申请人： INTEL CORPORATION

发明人： Pramod Malatkar ,  Kyle Yazzie ,  Naga Sivakumar Yagnamurthy ,  Richard J. Harries ,  Dilan Seneviratne ,  Praneeth Akkinepally ,  Xuefei Wan ,  Yonggang Li ,  Robert L. Sankman

IPC分类号： H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L25/10

CPC分类号： H01L23/34 ,  H01L23/3128 ,  H01L23/48 ,  H01L23/49582 ,  H01L23/49816 ,  H01L23/562 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00014

摘要： An electronic package that includes a substrate and an electronic component attached to the substrate. A laminated layer is attached to an upper surface of the substrate such that the laminated layer covers the electronic component. The electronic package may further include a stiffener mounted on the laminated layer where the stiffener is over the electronic component.