公开(公告)号：US20180350709A1

公开(公告)日：2018-12-06

申请号：US15778042

申请日：2015-11-24

Applicant: INTEL CORPORATION

Inventor： Pramod Malatkar ,  Kyle Yazzie ,  Naga Sivakumar Yagnamurthy ,  Richard J. Harries ,  Dilan Seneviratne ,  Praneeth Akkinepally ,  Xuefei Wan ,  Yonggang Li ,  Robert L. Sankman

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L25/10

CPC classification number: H01L23/34 ,  H01L23/3128 ,  H01L23/48 ,  H01L23/49582 ,  H01L23/49816 ,  H01L23/562 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electronic package that includes a substrate and an electronic component attached to the substrate. A laminated layer is attached to an upper surface of the substrate such that the laminated layer covers the electronic component. The electronic package may further include a stiffener mounted on the laminated layer where the stiffener is over the electronic component.

公开(公告)号：US09793225B2

公开(公告)日：2017-10-17

申请号：US15204303

申请日：2016-07-07

Applicant: Intel Corporation

Inventor： Pramod Malatkar ,  Richard J. Harries

IPC: H05K7/00 ,  H01L23/00 ,  H05K1/02 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L23/562 ,  H01L21/485 ,  H01L21/4857 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2224/16225 ,  H05K1/0271

Abstract: The present description relates to the field of fabricating microelectronic packages, wherein a microelectronic device may be attached to a microelectronic substrate with a compensator to control package warpage. The warpage compensator may be a low coefficient of thermal expansion material, including but not limited to silicon or a ceramic material, which is positioned on a land-side of the microelectronic device to counteract the thermal expansion effects of the microelectronic device.

公开(公告)号：US10985080B2

公开(公告)日：2021-04-20

申请号：US15778042

申请日：2015-11-24

Applicant: Intel Corporation

Inventor： Pramod Malatkar ,  Kyle Yazzie ,  Naga Sivakumar Yagnamurthy ,  Richard J. Harries ,  Dilan Seneviratne ,  Praneeth Akkinepally ,  Xuefei Wan ,  Yonggang Li ,  Robert L. Sankman

IPC: H01L23/31 ,  H01L23/34 ,  H01L23/48 ,  H01L25/10 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538

Abstract: An electronic package that includes a substrate and an electronic component attached to the substrate. A laminated layer is attached to an upper surface of the substrate such that the laminated layer covers the electronic component. The electronic package may further include a stiffener mounted on the laminated layer where the stiffener is over the electronic component.

公开(公告)号：US10002814B2

公开(公告)日：2018-06-19

申请号：US14195422

申请日：2014-03-03

Applicant: Intel Corporation

Inventor： Richard J. Harries ,  Sudarashan V. Rangaraj ,  Robert L. Sankman

IPC: H01L23/31 ,  H01L23/00

CPC classification number: H01L23/3128 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/05599 ,  H01L2224/10126 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19043 ,  H01L2224/05552

Abstract: Some embodiments of the present invention include apparatuses and methods relating to processing and packaging microelectronic devices that reduce stresses on and limit or eliminate crack propagation in the devices.

公开(公告)号：US20160322311A1

公开(公告)日：2016-11-03

申请号：US15204303

申请日：2016-07-07

Applicant: Intel Corporation

Inventor： Pramod Malatkar ,  Richard J. Harries

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/498 ,  H01L23/31

CPC classification number: H01L23/562 ,  H01L21/485 ,  H01L21/4857 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L2224/16225 ,  H05K1/0271

Abstract: The present description relates to the field of fabricating microelectronic packages, wherein a microelectronic device may be attached to a microelectronic substrate with a compensator to control package warpage. The warpage compensator may be a low coefficient of thermal expansion material, including but not limited to silicon or a ceramic material, which is positioned on a land-side of the microelectronic device to counteract the thermal expansion effects of the microelectronic device.