发明申请
- 专利标题: MICROPHONE PACKAGE
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申请号: US16053832申请日: 2018-08-03
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公开(公告)号: US20180352342A1公开(公告)日: 2018-12-06
- 发明人: Yoshihiro Higashi , Yoshihiko Fuji , Michiko Hara , Akiko Yuzawa , Shiori Kaji , Tomohiko Nagata , Akio Hori , Hideaki Fukuzawa
- 申请人: Kabushiki Kaisha Toshiba
- 申请人地址: JP Minato-ku
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Minato-ku
- 优先权: JP2012-254357 20121120
- 主分类号: H04R19/04
- IPC分类号: H04R19/04 ; H04R1/04 ; H04R7/10
摘要:
According to one embodiment, a microphone package includes: a pressure sensing element including a film and a device; and a cover. The film generates strain in response to pressure. The device includes: a first electrode; a second electrode; and a first magnetic layer. The first magnetic layer is provided between the first electrode and the second electrode and has a first magnetization. The cover includes: an upper portion; and a side portion. The side portion is magnetic and provided depending on the first magnetization and the second magnetization.
公开/授权文献
- US10477323B2 Microphone package 公开/授权日:2019-11-12
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