发明申请
- 专利标题： SEMICONDUCTOR DEVICE
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申请号： US15683059申请日： 2017-08-22
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公开(公告)号： US20190067145A1公开(公告)日： 2019-02-28
- 发明人: Hyunsuk Chun , Shams U. Arifeen , Chan H. Yoo , Tracy N. Tennant
- 申请人： Micron Technology, Inc.
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L21/48 ; H01L23/498 ; H01L21/683 ; H01L21/56
摘要：
A semiconductor device having a semiconductor die, a redistribution layer (RDL), and an encapsulant. The RDL layer can be formed on a first surface of the semiconductor die. The encapsulant can enclose a second surface and side surfaces of the semiconductor die. The encapsulant can enclose side portions of the RDL.
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