Invention Application
- Patent Title: INTERCONNECT FRAMES FOR SIP MODULES
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Application No.: US16147469Application Date: 2018-09-28
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Publication No.: US20190082538A1Publication Date: 2019-03-14
- Inventor: Lan H. Hoang , Raghunandan R. Chaware , Chang Liu , Takayoshi Katahira
- Applicant: Apple Inc.
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K1/11 ; H05K1/18 ; H05K1/02 ; H01R12/71 ; H01R12/70 ; B23Q1/01
Abstract:
Frames and other structures for system-in-package modules that may allow components on boards in the modules to communicate with each other.
Information query
