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公开(公告)号：US11388817B2
公开(公告)日：2022-07-12
申请号：US17184927
申请日：2021-02-25
申请人： Apple Inc.
发明人： Daniel D. Sunshine , David M. Kindlon , Michael B. Nussbaum , Andrew L. Rosenberg , Andrew Sterian , Breton M. Saunders , Christopher A. Schultz , David A. Bolt , Mark J. Beesley , Peter W. Mash , Steven Keating , Chang Liu , Lan Hoang
IPC分类号： H05K1/00 , H05K1/03 , H05K1/18 , H05K1/11 , H01L23/31 , H01L23/498 , H05K1/02 , D03D1/00 , A41D1/00
摘要： An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.
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公开(公告)号：US20190082538A1
公开(公告)日：2019-03-14
申请号：US16147469
申请日：2018-09-28
申请人： Apple Inc.
摘要： Frames and other structures for system-in-package modules that may allow components on boards in the modules to communicate with each other.
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公开(公告)号：US20160270213A1
公开(公告)日：2016-09-15
申请号：US15041033
申请日：2016-02-11
申请人： APPLE INC.
发明人： Amir Salehi , Vu T. Vo , Wyeman Chen , Chang Liu , Dennis R. Pyper , Steven Patrick Cardinali , Lan Hoang , Siddharth Nangia , Meng Chi Lee , Takayoshi Katahira
CPC分类号： H05K3/284 , B33Y80/00 , H05K1/0224 , H05K2201/0141 , H05K2201/0715 , H05K2201/10242 , H05K2201/10318 , H05K2201/10969 , H05K2201/2036
摘要： Readily manufactured structures for sealing or encapsulating devices in system-in-a-package modules, such that the modules are easily assembled, have a low-profile, and are space efficient. One example may provide readily manufactured covers for SIP modules. These modules may be easily assembled by attaching the cover to a top side of a substrate. These SIP modules may have a low-profile, for example when their height is reduced using one or more recesses in a bottom surface of a top of the recess, where the one or more recesses are arranged to accept one or more components. These SIP modules may be made space efficient by placing an edge of a cover near an edge of the substrate and connecting the plating of the cover using side plating on, or vias through, the substrate.
摘要翻译： 易于制造的结构，用于将封装或封装在系统级封装模块中，使得模块易于组装，具有薄型，并且具有空间效率。 一个示例可以提供用于SIP模块的容易制造的盖。 这些模块可以通过将盖附接到基板的顶侧来容易地组装。 这些SIP模块可以具有低轮廓，例如当使用凹部的顶部的底部表面中的一个或多个凹部来减小其高度时，其中一个或多个凹部布置成接受一个或多个部件。 这些SIP模块可以通过将盖的边缘放置在基板的边缘附近并且使用侧板或通孔穿过基板来连接盖的镀层来实现空间效率。
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公开(公告)号：US10485103B1
公开(公告)日：2019-11-19
申请号：US15439641
申请日：2017-02-22
申请人： Apple Inc.
发明人： Daniel D. Sunshine , David M. Kindlon , Michael B. Nussbaum , Andrew L. Rosenberg , Andrew Sterian , Breton M. Saunders , Christopher A. Schultz , David A. Bolt , Mark J. Beesley , Peter W. Mash , Steven Keating , Chang Liu , Lan Hoang
摘要： An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.
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公开(公告)号：US20170221604A1
公开(公告)日：2017-08-03
申请号：US15488393
申请日：2017-04-14
申请人： Apple Inc.
发明人： Joshua J. Pong , Colin J. Abraham , Jay E. Sha , Jongbae Park , Chang Liu
CPC分类号： H01R43/00 , H01R9/034 , H01R9/0515 , H01R13/506 , H01R13/6581 , H01R13/6596
摘要： Cable assemblies that may convey high speed signals while providing reduced signal noise, radiation, and susceptibility to interference. These and other examples may be readily manufactured. These and other examples may provide cables having a reduced thickness.
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公开(公告)号：US20230078536A1
公开(公告)日：2023-03-16
申请号：US17832346
申请日：2022-06-03
申请人： Apple Inc.
发明人： Ali N. Ergun , Bilal Mohamed Ibrahim Kani , Chang Liu , Ethan L. Huwe , Jeffrey J. Terlizzi , Jerzy S. Guterman , Jue Wang , Kishore N. Renjan , Kyusang Kim , Lan H. Hoang , Mandar S. Painaik , Manoj Vadeentavida , Sarah B. Gysbers , Takayoshi Katahira , Zhiqi Wang
摘要： System-in-package modules that can provide a high level of functionality, are space efficient, and are readily manufactured. In an example, a high-functionality system-in-package module can include both a wireless circuit and an antenna. In an example, a space-efficient system-in-package module can include different vertical interconnect paths that can be used to connect the wireless circuit to the antenna. In an example, instead of being shaped as a traditional rectangular cuboid, a space-efficient system-in-package module can have a shape that more closely matches contours of an enclosure for an electronic device.
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公开(公告)号：US20220346228A1
公开(公告)日：2022-10-27
申请号：US17860839
申请日：2022-07-08
申请人： Apple Inc.
发明人： Daniel D. Sunshine , David M. Kindlon , Michael B. Nussbaum , Andrew L. Rosenberg , Andrew Sterian , Breton M. Saunders , Christopher A. Schultz , David A. Bolt , Mark J. Beesley , Peter W. Mash , Steven Keating , Chang Liu , Lan Hoang
摘要： An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.
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公开(公告)号：US20210185808A1
公开(公告)日：2021-06-17
申请号：US17184927
申请日：2021-02-25
申请人： Apple Inc.
发明人： Daniel D. Sunshine , David M. Kindlon , Michael B. Nussbaum , Andrew L. Rosenberg , Andrew Sterian , Breton M. Saunders , Christopher A. Schultz , David A. Bolt , Mark J. Beesley , Peter W. Mash , Steven Keating , Chang Liu , Lan Hoang
摘要： An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.
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公开(公告)号：US20200084886A1
公开(公告)日：2020-03-12
申请号：US16685846
申请日：2019-11-15
申请人： Apple Inc.
发明人： Daniel D. Sunshine , David M. Kindlon , Michael B. Nussbaum , Andrew L. Rosenberg , Andrew Sterian , Breton M. Saunders , Christopher A. Schultz , David A. Bolt , Mark J. Beesley , Peter W. Mash , Steven Keating , Chang Liu , Lan Hoang
摘要： An item may include fabric having insulating and conductive yarns or other strands of material. The conductive strands may form signal paths. Electrical components can be mounted to the fabric. Each electrical component may have an electrical device such as a semiconductor die that is mounted on an interposer substrate. The interposer may have contacts that are soldered to the conductive strands. A protective cover may encapsulate portions of the electrical component. To create a robust connection between the electrical component and the fabric, the conductive strands may be threaded through recesses in the electrical component. The recesses may be formed in the interposer or may be formed in a protective cover on the interposer. Conductive material in the recess may be used to electrically and/or mechanically connect the conductive strand to a bond pad in the recess. Thermoplastic material may be used to seal the solder joint.
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公开(公告)号：US20190082534A1
公开(公告)日：2019-03-14
申请号：US15699946
申请日：2017-09-08
申请人： Apple Inc.
发明人： Lan H. Hoang , Chang Liu
摘要： Frames and other structures for system-in-package modules that may allow components on boards in the modules to communicate with each other.
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