公开(公告)号：US10602612B1

公开(公告)日：2020-03-24

申请号：US16512280

申请日：2019-07-15

Applicant: Apple Inc.

Inventor： Lan H. Hoang ,  Takayoshi Katahira ,  Leilei Zhang ,  Raghunandan R. Chaware

IPC: H05K1/14 ,  H05K1/11

Abstract: Stacked circuit board structures are described. In an embodiment, a plurality of vertical devices serves as electrical interconnections between the first circuit board and the second circuit board. In an embodiment, a plurality of vertical interconnects or pins serve as electrical interconnections between the first circuit board and the second circuit board. The vertical interconnects or pins may be arranged side-by-side with a plurality of vertical or horizontal devices.

公开(公告)号：US20190082538A1

公开(公告)日：2019-03-14

申请号：US16147469

申请日：2018-09-28

Applicant: Apple Inc.

Inventor： Lan H. Hoang ,  Raghunandan R. Chaware ,  Chang Liu ,  Takayoshi Katahira

IPC: H05K1/14 ,  H05K1/11 ,  H05K1/18 ,  H05K1/02 ,  H01R12/71 ,  H01R12/70 ,  B23Q1/01

Abstract: Frames and other structures for system-in-package modules that may allow components on boards in the modules to communicate with each other.