Invention Application
- Patent Title: LIGHT-EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Application No.: US16192864Application Date: 2018-11-16
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Publication No.: US20190088839A1Publication Date: 2019-03-21
- Inventor: Jin-sub LEE , Yong-il KIM , Han-kyu SEONG , Young-jin CHOI
- Applicant: Samsung Electronics Co., Ltd.
- Priority: KR10-2016-0174771 20161220; KR10-2017-0031357 20170313
- Main IPC: H01L33/58
- IPC: H01L33/58 ; H01L33/50 ; H01L33/60 ; H01L33/48 ; F21K9/27 ; F21K9/233 ; F21K9/237 ; G09F13/00 ; H01L33/62 ; H01L33/06 ; F21V8/00 ; H01L33/32 ; H01L33/30 ; F21K9/232 ; G02F1/1335 ; F21Y115/10 ; F21Y103/10 ; F21V23/04 ; F21S8/02 ; F21K9/275

Abstract:
A light-emitting diode (LED) package includes: a reflective structure including a cavity, a bottom portion having a through hole, and a sidewall portion surrounding the cavity and the bottom portion and having an inclined inner side surface; an electrode pad inserted into the through hole; an LED on the bottom portion in the cavity, the LED including a light-emitting structure electrically connected to the electrode pad and a phosphor formed on the light-emitting structure; and a lens structure filling the cavity and formed on the reflective structure.
Public/Granted literature
- US10475972B2 Light-emitting diode package and method of manufacturing the same Public/Granted day:2019-11-12
Information query
IPC分类: