Invention Application
- Patent Title: Determining Thermal Margins In A Multi-Die Processor
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Application No.: US16353083Application Date: 2019-03-14
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Publication No.: US20190204885A1Publication Date: 2019-07-04
- Inventor: Sandeep Ahuja , Jeremy Ridge , Michael Berktold
- Applicant: Intel Corporation
- Main IPC: G06F1/20
- IPC: G06F1/20 ; G06F1/3203

Abstract:
In one embodiment, a processor comprises: a first die including at least one core and at least one first die thermal sensor; a second die including at least one memory and at least one second die thermal sensor; and a thermal controller to receive first thermal data from the at least one first die thermal sensor and second thermal data from the at least one second die thermal sensor, calculate a first thermal margin for the first die based at least in part on the first thermal data and a first thermal loadline for the first die and calculate a second thermal margin for the second die based at least in part on the second thermal data and a second thermal loadline for the second die. Other embodiments are described and claimed.
Public/Granted literature
- US10908660B2 Determining thermal margins in a multi-die processor Public/Granted day:2021-02-02
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