公开(公告)号：US20190204885A1

公开(公告)日：2019-07-04

申请号：US16353083

申请日：2019-03-14

Applicant: Intel Corporation

Inventor： Sandeep Ahuja ,  Jeremy Ridge ,  Michael Berktold

IPC: G06F1/20 ,  G06F1/3203

CPC classification number: G06F1/206 ,  G06F1/3203 ,  G06F1/324 ,  G06F1/3243 ,  G06F1/3296 ,  Y02D10/126 ,  Y02D10/152 ,  Y02D10/16 ,  Y02D10/172 ,  Y02D50/20

Abstract: In one embodiment, a processor comprises: a first die including at least one core and at least one first die thermal sensor; a second die including at least one memory and at least one second die thermal sensor; and a thermal controller to receive first thermal data from the at least one first die thermal sensor and second thermal data from the at least one second die thermal sensor, calculate a first thermal margin for the first die based at least in part on the first thermal data and a first thermal loadline for the first die and calculate a second thermal margin for the second die based at least in part on the second thermal data and a second thermal loadline for the second die. Other embodiments are described and claimed.

公开(公告)号：US10908660B2

公开(公告)日：2021-02-02

申请号：US16353083

申请日：2019-03-14

Applicant: Intel Corporation

Inventor： Sandeep Ahuja ,  Jeremy Ridge ,  Michael Berktold

IPC: G06F1/32 ,  G06F1/20 ,  G06F1/3203 ,  G06F1/324 ,  G06F1/3296 ,  G06F1/3234 ,  G01K3/08

Abstract: In one embodiment, a processor comprises: a first die including at least one core and at least one first die thermal sensor; a second die including at least one memory and at least one second die thermal sensor; and a thermal controller to receive first thermal data from the at least one first die thermal sensor and second thermal data from the at least one second die thermal sensor, calculate a first thermal margin for the first die based at least in part on the first thermal data and a first thermal loadline for the first die and calculate a second thermal margin for the second die based at least in part on the second thermal data and a second thermal loadline for the second die. Other embodiments are described and claimed.

公开(公告)号：US10248173B2

公开(公告)日：2019-04-02

申请号：US15086387

申请日：2016-03-31

Applicant: Intel Corporation

Inventor： Sandeep Ahuja ,  Jeremy Ridge ,  Michael Berktold

IPC: G06F1/20 ,  G06F1/32 ,  G06F1/3203 ,  G01K3/08

Abstract: In one embodiment, a processor comprises: a first die including at least one core and at least one first die thermal sensor; a second die including at least one memory and at least one second die thermal sensor; and a thermal controller to receive first thermal data from the at least one first die thermal sensor and second thermal data from the at least one second die thermal sensor, calculate a first thermal margin for the first die based at least in part on the first thermal data and a first thermal loadline for the first die and calculate a second thermal margin for the second die based at least in part on the second thermal data and a second thermal loadline for the second die. Other embodiments are described and claimed.

公开(公告)号：US20170285699A1

公开(公告)日：2017-10-05

申请号：US15086387

申请日：2016-03-31

Applicant: Intel Corporation

Inventor： Sandeep Ahuja ,  Jeremy Ridge ,  Michael Berktold

IPC: G06F1/20 ,  G06F1/32 ,  G05B15/02

CPC classification number: G06F1/206 ,  G06F1/3203 ,  G06F1/324 ,  G06F1/3243 ,  G06F1/3296 ,  Y02D10/126 ,  Y02D10/152 ,  Y02D10/16 ,  Y02D10/172 ,  Y02D50/20

Abstract: In one embodiment, a processor comprises: a first die including at least one core and at least one first die thermal sensor; a second die including at least one memory and at least one second die thermal sensor; and a thermal controller to receive first thermal data from the at least one first die thermal sensor and second thermal data from the at least one second die thermal sensor, calculate a first thermal margin for the first die based at least in part on the first thermal data and a first thermal loadline for the first die and calculate a second thermal margin for the second die based at least in part on the second thermal data and a second thermal loadline for the second die. Other embodiments are described and claimed.