Invention Application
- Patent Title: MULTI-CHIP PACKAGES AND SINTERABLE PASTE FOR USE WITH THERMAL INTERFACE MATERIALS
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Application No.: US16343703Application Date: 2016-12-07
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Publication No.: US20190267306A1Publication Date: 2019-08-29
- Inventor: Nachiket R. RARAVIKAR , Ravindranath V. MAHAJAN , Robert L. SANKMAN , James C. MATAYABAS, Jr. , Ken P. HACKENBERG , Nayandeep K. MAHANTA , David D. OLMOZ
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- International Application: PCT/US2016/065374 WO 20161207
- Main IPC: H01L23/373
- IPC: H01L23/373 ; H01L23/42 ; H01L23/367
Abstract:
In some embodiments a semiconductor die package includes a package substrate, a plurality of dies each attached to the package substrate, a layer of a thermally conducting sintered paste over the top of each die, a layer of flexible polymer thermal interface material over the sintered paste, and a heat spreader over and thermally connected to the polymer thermal interface material.
Information query
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