公开(公告)号：US20190267306A1

公开(公告)日：2019-08-29

申请号：US16343703

申请日：2016-12-07

Applicant: Intel Corporation

Inventor： Nachiket R. RARAVIKAR ,  Ravindranath V. MAHAJAN ,  Robert L. SANKMAN ,  James C. MATAYABAS, Jr. ,  Ken P. HACKENBERG ,  Nayandeep K. MAHANTA ,  David D. OLMOZ

IPC: H01L23/373 ,  H01L23/42 ,  H01L23/367

Abstract: In some embodiments a semiconductor die package includes a package substrate, a plurality of dies each attached to the package substrate, a layer of a thermally conducting sintered paste over the top of each die, a layer of flexible polymer thermal interface material over the sintered paste, and a heat spreader over and thermally connected to the polymer thermal interface material.

公开(公告)号：US20180374776A1

公开(公告)日：2018-12-27

申请号：US15774990

申请日：2016-01-11

Applicant: Intel Corporation

Inventor： Boxi LIU ,  Hemanth K. DHAVALESWARAPU ,  Syadwad JAIN ,  James C. MATAYABAS, Jr.

IPC: H01L23/373 ,  H01L23/367 ,  H01L23/00 ,  H01L25/065 ,  H01L21/48

Abstract: A multiple chip package is described with multiple thermal interface materials. In one example, a package has a substrate, a first semiconductor die coupled to the substrate, a second semiconductor die coupled to the substrate, a heat spreader coupled to the die, wherein the first die has a first distance to the heat spreader and the second die has a second distance to the heat spreader, a first filled thermal interface material (TIM) between the first die and the heat spreader to mechanically and thermally couple the heat spreader to the die, and a second filled TIM between the second die and the heat spreader to mechanically and thermally couple the heat spreader to the second die.

公开(公告)号：US20180323130A1

公开(公告)日：2018-11-08

申请号：US15771025

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Boxi LIU ,  Syadwad JAIN ,  Jelena CULIC-VISKOTA ,  Nachiket R. RARAVIKAR ,  James C. MATAYABAS, Jr.

IPC: H01L23/373 ,  C08K3/08 ,  C08L83/04 ,  C08G77/12 ,  H01L23/367 ,  C09K5/06 ,  H01L23/00

CPC classification number: H01L23/3737 ,  C08G77/12 ,  C08G77/20 ,  C08K3/08 ,  C08K5/00 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  C09K5/063 ,  H01L23/34 ,  H01L23/3672 ,  H01L24/83 ,  H01L2224/8384 ,  H01L2224/83862

Abstract: An adhesive polymer thermal interface material is described with sintered fillers for thermal conductivity in micro-electronic packaging. Embodiments include a polymer thermal interface material (PTIM) with sinterable thermally conductive filler particles, a dispersant, and a silicone polymer matrix.