公开(公告)号：US20190267306A1

公开(公告)日：2019-08-29

申请号：US16343703

申请日：2016-12-07

Applicant: Intel Corporation

Inventor： Nachiket R. RARAVIKAR ,  Ravindranath V. MAHAJAN ,  Robert L. SANKMAN ,  James C. MATAYABAS, Jr. ,  Ken P. HACKENBERG ,  Nayandeep K. MAHANTA ,  David D. OLMOZ

IPC: H01L23/373 ,  H01L23/42 ,  H01L23/367

Abstract: In some embodiments a semiconductor die package includes a package substrate, a plurality of dies each attached to the package substrate, a layer of a thermally conducting sintered paste over the top of each die, a layer of flexible polymer thermal interface material over the sintered paste, and a heat spreader over and thermally connected to the polymer thermal interface material.