发明申请
- 专利标题: FULLY EMBEDDED MAGNETIC-CORE IN CORE LAYER FOR CUSTOM INDUCTOR IN IC SUBSTRATE
-
申请号: US15911549申请日: 2018-03-05
-
公开(公告)号: US20190272936A1公开(公告)日: 2019-09-05
- 发明人: Chong ZHANG , Cheng XU , Ying WANG , Junnan ZHAO , Meizi JIAO , Yikang DENG
- 申请人: Intel Corporation
- 主分类号: H01F27/24
- IPC分类号: H01F27/24 ; G05F1/10 ; H01L49/02 ; H01F41/02
摘要:
Embodiments include inductors with embedded magnetic cores and methods of forming such inductors. Some embodiments may include an integrated circuit package that utilizes such inductors. For example, the integrated circuit package may include an integrated circuit die and a multi-phase voltage regulator electrically coupled to the integrated circuit die. In an embodiment, the multi-phase voltage regulator includes a substrate core and a plurality of inductors in the substrate core. In an embodiment, the inductors may include a conductive loop in and around the substrate core. In an embodiment, the conductive loops are electrically coupled to a voltage out line. Embodiments may also include a magnetic core surrounded by the conductive loops. The magnetic core is separated from surfaces of the conductive loops by the substrate core
信息查询