Invention Application
- Patent Title: CMP PAD CONSTRUCTION WITH COMPOSITE MATERIAL PROPERTIES USING ADDITIVE MANUFACTURING PROCESSES
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Application No.: US16746065Application Date: 2020-01-17
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Publication No.: US20200147750A1Publication Date: 2020-05-14
- Inventor: Rajeev BAJAJ , Kasiraman KRISHNAN , Mahendra C. ORILALL , Daniel REDFIELD , Fred C. REDEKER , Nag B. PATIBANDLA , Gregory E. MENK , Jason G. FUNG , Russell Edward PERRY , Robert E. DAVENPORT
- Applicant: Applied Materials, Inc.
- Main IPC: B24B37/26
- IPC: B24B37/26 ; B24D18/00 ; B24B37/22 ; B24B37/20 ; B33Y80/00 ; B29C64/112 ; B24B37/24

Abstract:
Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.
Public/Granted literature
- US11958162B2 CMP pad construction with composite material properties using additive manufacturing processes Public/Granted day:2024-04-16
Information query