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公开(公告)号：US20170133252A1
公开(公告)日：2017-05-11
申请号：US14935134
申请日：2015-11-06
Applicant: Applied Materials, Inc.
Inventor： Jason G. FUNG , Rajeev BAJAJ , Daniel REDFIELD , Aniruddh KHANNA , Mario CORNEJO , Gregory E. MENK , John WATKINS
IPC: H01L21/67 , H01L21/66 , B24B37/26 , B29C67/00 , B24B49/14 , B24B49/16 , B24B49/10 , H01L21/306 , B24B49/00
CPC classification number: H01L21/67253 , B24B37/26 , B24B49/003 , B24B49/10 , B24B49/14 , B24B49/16 , B29C64/106 , B29K2995/0003 , B29K2995/0005 , B29L2031/736 , B33Y10/00 , B33Y80/00 , H01L21/30625 , H01L21/67075 , H01L21/67294 , H01L22/12 , H01L22/20 , H01L22/26
Abstract: Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.
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公开(公告)号：US20160107295A1
公开(公告)日：2016-04-21
申请号：US14885950
申请日：2015-10-16
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ , Daniel REDFIELD , Mahendra C. ORILALL , Boyi FU , Aniruddh KHANNA , Jason G. FUNG , Mario CORNEJO , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Veera Raghava Reddy KAKIREDDY , Ashavani KUMAR , Venkatachalam HARIHARAN , Gregory E. MENK , Fred C. REDEKER , Nag B. PATIBANDLA , Hou T. NG , Robert E. DAVENPORT , Amritanshu SINHA
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
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公开(公告)号：US20180207770A1
公开(公告)日：2018-07-26
申请号：US15875867
申请日：2018-01-19
Applicant: Applied Materials, Inc.
Inventor： Robert D. TOLLES , Gregory E. MENK , Eric DAVEY , You WANG , Huyen Karen TRAN , Fred C. REDEKER , Veera Raghava Reddy KAKIREDDY , Ekaterina MIKHAYLICHENKO , Jay GURUSAMY
Abstract: A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more implementations of the present disclosure, an advanced polishing article has been developed, which does not require abrasive pad conditioning. In some implementations of the present disclosure, the advanced polishing article comprises a polymeric sheet having a polishing surface with a raised surface texture or “micro-features” and/or a plurality of grooves or “macro-features” formed in the polishing surface. In some implementations, the raised surface texture is embossed, etched, machined or otherwise formed in the polishing surface prior to installing and using the advanced polishing article in a polishing system. In one implementation, the raised features have a height within one order of magnitude of the features removed from the substrate during polishing.
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公开(公告)号：US20160101500A1
公开(公告)日：2016-04-14
申请号：US14695778
申请日：2015-04-24
Applicant: Applied Materials, Inc.
Inventor： Jason Garcheung FUNG , Rajeev BAJAJ , Kasiraman KRISHNAN , Mahendra C. ORILALL , Fred C. REDEKER , Russell Edward PERRY , Gregory E. MENK , Daniel REDFIELD
IPC: B24B37/26 , B24B55/02 , B24B37/015
CPC classification number: B24B37/26 , B24B37/015 , B24B55/02
Abstract: A polishing pad for chemical mechanical polishing is provided. The polishing pad includes a base region having a supporting surface. The polishing pad further includes a plurality of polishing features forming a polishing surface, the polishing surface opposing the supporting surface. The polishing pad further includes one or more channels formed in an interior region of the polishing pad and extending at least partly around a center of the polishing pad, wherein each channel is fluidly coupled to at least one port.
Abstract translation: 提供了用于化学机械抛光的抛光垫。 抛光垫包括具有支撑表面的基底区域。 抛光垫还包括形成抛光表面的多个抛光特征，抛光表面与支撑表面相对。 抛光垫还包括形成在抛光垫的内部区域中并且至少部分地围绕抛光垫的中心延伸的一个或多个通道，其中每个通道流体地联接到至少一个端口。
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公开(公告)号：US20160114458A1
公开(公告)日：2016-04-28
申请号：US14920801
申请日：2015-10-22
Applicant: APPLIED MATERIALS, INC.
Inventor： Rajeev BAJAJ , Daniel REDFIELD , Mahendra C. ORILALL , Boyi FU , Aniruddh KHANNA , Jason G. FUNG , Mario CORNEJO , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Veera Raghava REDDY , Ashavani KUMAR , Venkatachalam HARIHARAN , Gregory E. MENK , Fred C. REDEKER , Nag B. PATIBANDLA , Hou T. NG , Robert E. DAVENPORT , Amritanshu SINHA
CPC classification number: B24B37/26 , B24B37/22 , B24B37/24 , B24D3/28 , B24D11/00 , B24D11/001 , B24D11/04 , B33Y10/00 , B33Y80/00
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
Abstract translation: 本公开的实施例涉及具有可调节的化学，材料和结构特性的高级抛光垫及其制造方法。 根据本公开的一个或多个实施例，已经发现可以通过诸如三维（3D）印刷工艺的添加剂制造工艺来生产具有改进性能的抛光垫。 因此，本公开的实施例可以提供具有离散特征和几何形状的先进抛光垫，其由至少两种不同的材料形成，包括功能性聚合物，功能低聚物，反应性稀释剂和固化剂。 例如，先进的抛光垫可以由多个聚合物层形成，通过至少一种树脂前体组合物的自动顺序沉积，然后至少一个固化步骤，其中各层可代表至少一种聚合物组合物和/ 或不同组成的区域。
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Patent Agency Ranking
6.发明申请公开(公告)号：US20160107381A1
公开(公告)日：2016-04-21
申请号：US14863409
申请日：2015-09-23
Applicant: Applied Materials, Inc.
Inventor： Kasiraman KRISHNAN , Daniel REDFIELD , Russell Edward PERRY , Gregory E. MENK , Rajeev BAJAJ , Fred C. REDEKER , Nag B. PATIBANDLA , Mahendra C. ORILALL , Jason G. FUNG
CPC classification number: B29C64/112 , B24B37/22 , B24B37/24 , B24B37/26 , B24D11/001 , B29K2105/16 , B29K2995/007 , B29L2031/736
Abstract: A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.
Abstract translation: 一种抛光制品制造系统，包括进料部分和卷取部分，所述卷取部分包括供料辊，所述供料辊具有设置在其上用于化学机械抛光工艺的抛光制品，所述打印部分包括设置在所述进料之间的多个打印头 以及设置在所述进料部和所述卷取部之间的固化部，所述固化部包括热固化装置和电磁固化装置中的一个或两个。
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公开(公告)号：US20160107287A1
公开(公告)日：2016-04-21
申请号：US14887240
申请日：2015-10-19
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ , Daniel REDFIELD , Mahendra C. ORILALL , Boyi FU , Aniruddh KHANNA , Jason G. FUNG , Mario CORNEJO , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Veera Raghava Reddy KAKIREDDY , Ashavani KUMAR , Venkatachalam HARIHARAN , Gregory E. MENK , Fred C. REDEKER , Nag B. PATIBANDLA , Hou T. NG , Robert E. DAVENPORT , Amritanshu SINHA
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
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公开(公告)号：US20210107116A1
公开(公告)日：2021-04-15
申请号：US17114633
申请日：2020-12-08
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ , Daniel REDFIELD , Mahendra C. ORILALL , Boyi FU , Aniruddh Jagdish KHANNA , Jason G. FUNG , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Veera Raghava Reddy KAKIREDDY , Gregory E. MENK , Nag B. PATIBANDLA
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
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9.发明申请公开(公告)号：US20200147750A1
公开(公告)日：2020-05-14
申请号：US16746065
申请日：2020-01-17
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ , Kasiraman KRISHNAN , Mahendra C. ORILALL , Daniel REDFIELD , Fred C. REDEKER , Nag B. PATIBANDLA , Gregory E. MENK , Jason G. FUNG , Russell Edward PERRY , Robert E. DAVENPORT
Abstract: Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.
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10.发明申请公开(公告)号：US20180043613A1
公开(公告)日：2018-02-15
申请号：US15722810
申请日：2017-10-02
Applicant: Applied Materials, Inc.
Inventor： Kasiraman KRISHNAN , Daniel REDFIELD , Russell Edward PERRY , Gregory E. MENK , Rajeev BAJAJ , Fred C. REDEKER , Nag B. PATIBANDLA , Mahendra C. ORILALL , Jason G. FUNG
IPC: B24B37/26 , B24B37/22 , B29L31/00 , B29K105/16
Abstract: A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.
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