Invention Application
- Patent Title: SLURRY COMPOSITION FOR POLISHING TUNGSTEN BARRIER LAYER
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Application No.: US16323514Application Date: 2017-06-16
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Publication No.: US20200157382A1Publication Date: 2020-05-21
- Inventor: Han Teo PARK , Hyun Goo KONG , Sang Mi LEE
- Applicant: KCTECH CO.,LTD.
- Applicant Address: KR Anseong-si Gyeonggi-do
- Assignee: KCTECH CO.,LTD.
- Current Assignee: KCTECH CO.,LTD.
- Current Assignee Address: KR Anseong-si Gyeonggi-do
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@672c8e26
- International Application: PCT/KR2017/006314 WO 20170616
- Main IPC: C09G1/02
- IPC: C09G1/02 ; C09K3/14
Abstract:
The present invention relates to a slurry composition for polishing a tungsten barrier layer. A slurry composition for polishing a tungsten barrier layer according to an embodiment of the present invention comprises abrasive grains and a sulfur-containing amino acid, and can improve edge over erosion (EOE).
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