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公开(公告)号：US20200157382A1
公开(公告)日：2020-05-21
申请号：US16323514
申请日：2017-06-16
Applicant: KCTECH CO.,LTD.
Inventor： Han Teo PARK , Hyun Goo KONG , Sang Mi LEE
Abstract: The present invention relates to a slurry composition for polishing a tungsten barrier layer. A slurry composition for polishing a tungsten barrier layer according to an embodiment of the present invention comprises abrasive grains and a sulfur-containing amino acid, and can improve edge over erosion (EOE).
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