Invention Application
- Patent Title: POLISHING SLURRY AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
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Application No.: US16444076Application Date: 2019-06-18
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Publication No.: US20200161141A1Publication Date: 2020-05-21
- Inventor: Do Yoon KIM , Kenji TAKAI
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@36587909
- Main IPC: H01L21/321
- IPC: H01L21/321 ; C09G1/02 ; C09K3/14 ; H01L21/306 ; B24B37/04

Abstract:
A polishing slurry includes a carbon polishing particle and an exothermic material.
Public/Granted literature
- US10957557B2 Polishing slurry and method of manufacturing semiconductor device Public/Granted day:2021-03-23
Information query
IPC分类: