Invention Application
- Patent Title: METHOD AND APPARATUS FOR THIN WAFER CARRIER
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Application No.: US16198569Application Date: 2018-11-21
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Publication No.: US20200161156A1Publication Date: 2020-05-21
- Inventor: Jingyu QIAO , Qiwei LIANG , Viachslav BABAYAN , Seshadri RAMASWAMI , Srinivas D. NEMANI
- Applicant: APPLIED MATERIALS, INC.
- Main IPC: H01L21/683
- IPC: H01L21/683 ; C23C16/40 ; C23C16/56

Abstract:
Embodiments disclosed herein may include an electrostatic chuck (ESC) carrier. In an embodiment, the ESC carrier may comprise a carrier substrate having a first surface and a second surface opposite the first surface. In an embodiment, a first through substrate opening and a second through substrate opening may pass through the carrier substrate from the first surface to the second surface. Embodiments may include a first conductor in the first through substrate opening, and a second conductor in the second through substrate opening. In an embodiment, the ESC carrier may further comprise a first electrode over the first surface of the carrier substrate and electrically coupled to the first conductor, and a second electrode over the first surface of the carrier substrate and electrically coupled to the second conductor. In an embodiment, an oxide layer may be formed over the first electrode and the second electrode.
Public/Granted literature
- US11094573B2 Method and apparatus for thin wafer carrier Public/Granted day:2021-08-17
Information query
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