Invention Application
- Patent Title: DIE BACKSIDE STRUCTURES FOR ENHANCING LIQUID COOLING OF HIGH POWER MULTI-CHIP PACKAGE (MCP) DICE
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Application No.: US16612340Application Date: 2017-06-30
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Publication No.: US20200176352A1Publication Date: 2020-06-04
- Inventor: Je-Young CHANG , Chandra M. JHA , Shankar DEVASENATHIPATHY , Feras EID , John C. JOHNSON
- Applicant: Intel Corporation
- International Application: PCT/US2017/040286 WO 20170630
- Main IPC: H01L23/427
- IPC: H01L23/427 ; H01L23/26 ; H01L23/373 ; H01L23/433 ; H01L21/48 ; F28D15/02

Abstract:
An integrated circuit die includes a device side and a backside opposite the device side, wherein the backside includes a heat transfer enhancement configuration formed therein or a heat transfer enhancement structure formed thereon each of which enhance a heat transfer area or a boiling nucleation site density over a planar backside surface. A method of forming an integrated circuit assembly includes disposing a heat exchanger on a multi-chip package, the multi-chip package including at least one integrated circuit die including a device side and an opposite backside includes a heat transfer enhancement configuration formed therein or a heat enhancement structure formed thereon; and contacting the backside of the at least one integrated circuit die with water or other cooling fluids, such as a mixture of water and antifreeze, alcohol, inert fluorinated hydrocarbon, helium, and/or other suitable cooling fluid (either liquid or gas).
Information query
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