公开(公告)号：US20200176352A1

公开(公告)日：2020-06-04

申请号：US16612340

申请日：2017-06-30

申请人： Intel Corporation

发明人： Je-Young CHANG ,  Chandra M. JHA ,  Shankar DEVASENATHIPATHY ,  Feras EID ,  John C. JOHNSON

IPC分类号： H01L23/427 ,  H01L23/26 ,  H01L23/373 ,  H01L23/433 ,  H01L21/48 ,  F28D15/02

摘要： An integrated circuit die includes a device side and a backside opposite the device side, wherein the backside includes a heat transfer enhancement configuration formed therein or a heat transfer enhancement structure formed thereon each of which enhance a heat transfer area or a boiling nucleation site density over a planar backside surface. A method of forming an integrated circuit assembly includes disposing a heat exchanger on a multi-chip package, the multi-chip package including at least one integrated circuit die including a device side and an opposite backside includes a heat transfer enhancement configuration formed therein or a heat enhancement structure formed thereon; and contacting the backside of the at least one integrated circuit die with water or other cooling fluids, such as a mixture of water and antifreeze, alcohol, inert fluorinated hydrocarbon, helium, and/or other suitable cooling fluid (either liquid or gas).

公开(公告)号：US20160172222A1

公开(公告)日：2016-06-16

申请号：US15050387

申请日：2016-02-22

申请人： INTEL CORPORATION

发明人： John C. JOHNSON ,  Sandeep B. SANE ,  Sandeep RAZDAN ,  Edward R. PRACK ,  Leonel R. ARANA ,  Peter A. DAVISON ,  Eric J. MORET ,  Lawrence M. PALANUK ,  Gregory A. STONE

IPC分类号： H01L21/673 ,  H01L21/683 ,  H01L21/78 ,  H01L21/67 ,  H01L21/677

CPC分类号： H01L21/67333 ,  H01L21/67265 ,  H01L21/67309 ,  H01L21/67356 ,  H01L21/67363 ,  H01L21/67383 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67778 ,  H01L21/68 ,  H01L21/6833 ,  H01L21/68764 ,  H01L21/68771 ,  H01L21/78 ,  H05K13/0084

摘要： A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.

公开(公告)号：US20160377658A1

公开(公告)日：2016-12-29

申请号：US14748976

申请日：2015-06-24

申请人： INTEL CORPORATION

发明人： Paul J. DIGLIO ,  John C. JOHNSON ,  Weihua TANG

IPC分类号： G01R1/44 ,  G01R31/26

CPC分类号： G01R31/2874

摘要： Improved fluid flow is described for a temperature control actuator that is used in semiconductor device test. In one example, the apparatus includes a top plate configured to thermally connect to a semiconductor device under test, a channel plate thermally connected to the top plate and having a plurality of fluid channels to receive a thermally controlled fluid from an inlet to exchange heat with the thermally controlled fluid in the channel and to eliminate the thermally controlled fluid to an outlet, a manifold to provide the thermally controlled fluid to the inlet and to receive the thermally controlled fluid through the outlet, and a flow guide in the channel thermally connected to the top plate.

摘要翻译： 对用于半导体器件测试的温度控制致动器描述了改进的流体流动。 在一个示例中，该装置包括被配置为热连接到被测半导体器件的顶板，热连接到顶板的通道板，并且具有多个流体通道，用于从入口接收热控流体以与 通道中的热控制流体并且将热控流体消除到出口，歧管以将热控流体提供到入口并且通过出口接收热控流体，以及通道中的流动引导件热连接到 顶板。

公开(公告)号：US20170032991A1

公开(公告)日：2017-02-02

申请号：US15295943

申请日：2016-10-17

申请人： INTEL CORPORATION

发明人： John C. JOHNSON ,  Sandeep B. SANE ,  Sandeep RAZDAN ,  Edward R. PRACK ,  Leonel R. ARANA ,  Peter A. DAVISON ,  Eric J. MORET ,  Lawrence M. PALANUK ,  Gregory A. STONE

IPC分类号： H01L21/673 ,  H01L21/78 ,  H01L21/683 ,  H01L21/67 ,  H01L21/677

CPC分类号： H01L21/67333 ,  H01L21/67265 ,  H01L21/67309 ,  H01L21/67356 ,  H01L21/67363 ,  H01L21/67383 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67778 ,  H01L21/68 ,  H01L21/6833 ,  H01L21/68764 ,  H01L21/68771 ,  H01L21/78 ,  H05K13/0084

摘要： A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.

摘要翻译： 一种方法包括识别晶片上的多个管芯的晶片位置，将多个管芯中的每个管芯的晶片位置存储在数据库中，将晶片切割成多个单个管芯，将每个单模管芯定位在管芯中 在托盘上的位置位置，并将模具位置存储在数据库中的每个单个模具的托盘上。 数据库包括包括与每个模具位置相关联的晶片位置的信息。 托盘被运送到处理工具，并且多个分割模具中的至少一个从托盘上的模具位置移除并在处理工具中进行处理。 在处理之前，单独模具位于托盘上的相同的限定位置处理被处理的单个模具。 描述和要求保护其他实施例。