- 专利标题: Laser Machining a Transparent Workpiece
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申请号: US16643641申请日: 2018-09-03
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公开(公告)号: US20200206841A1公开(公告)日: 2020-07-02
- 发明人: Klaus Bergner , Stefan Nolte
- 申请人: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. , Friedrich-Schiller-Universität Jena
- 申请人地址: DE München DE Jena
- 专利权人: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.,Friedrich-Schiller-Universität Jena
- 当前专利权人: Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.,Friedrich-Schiller-Universität Jena
- 当前专利权人地址: DE München DE Jena
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@74e91055 com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@645acd6a
- 国际申请: PCT/EP2018/073604 WO 20180903
- 主分类号: B23K26/00
- IPC分类号: B23K26/00 ; B23K26/03 ; B23K26/062 ; B23K26/50 ; B23K26/0622 ; B23K26/53 ; B23K26/064 ; B23K26/06 ; G01N21/39 ; C03C15/00
摘要:
The invention relates to a method for machining a transparent workpiece (4) by generating non-linear absorption of laser radiation in a laser beam focus located in a volume of the workpiece (4). The object of the invention is that of providing a method of improved precision and quality, and a corresponding device, for laser machining of workpieces. In particular, it is also intended for it to be possible for workpieces made of composite materials or of other special materials, such as filter glass, to be machined at an improved level of quality. For this purpose, the method according to the invention comprises the following steps: spectroscopic measurement of the linear absorption of the laser radiation in the workpiece (4), selecting a working wavelength at which the linear absorption is low, and machining the workpiece (4) by means of application of laser radiation at the working wavelength. The invention furthermore relates to a corresponding device for machining a transparent workpiece (4).
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