Invention Application
- Patent Title: FLEX BUS PROTOCOL NEGOTIATION AND ENABLING SEQUENCE
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Application No.: US16812156Application Date: 2020-03-06
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Publication No.: US20200210366A1Publication Date: 2020-07-02
- Inventor: Debendra Das Sharma , Michelle C. Jen , Prahladachar Jayaprakash Bharadwaj , Bruce A. Tennant , Mahesh Wagh
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: G06F13/40
- IPC: G06F13/40 ; G06F13/42

Abstract:
Systems, methods, and devices can involve a host device that includes a root complex, a link, and an interconnect protocol stack coupled to a bus link. The interconnect protocol stack can include multiplexing logic to select one of a Peripheral Component Interconnect Express (PCIe) upper layer mode, or an accelerator link protocol upper layer mode, the PCIe upper layer mode or the accelerator link protocol upper layer mode to communicate over the link, and physical layer logic to determine one or more low latency features associated with one or both of the PCIe upper layer mode or the accelerator link protocol upper layer mode.
Public/Granted literature
- US11144492B2 Flex bus protocol negotiation and enabling sequence Public/Granted day:2021-10-12
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