Invention Application
- Patent Title: SUBSTRATE FOR A TEMPERATURE-COMPENSATED SURFACE ACOUSTIC WAVE DEVICE OR VOLUME ACOUSTIC WAVE DEVICE
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Application No.: US16829604Application Date: 2020-03-25
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Publication No.: US20200228088A1Publication Date: 2020-07-16
- Inventor: Marcel Broekaart , Thierry Barge , Pascal Guenard , Ionut Radu , Eric Desbonnets , Oleg Kononchuk
- Applicant: Soitec
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@61bc7eb4
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H01L41/312 ; H03H3/02 ; H01L27/20 ; H01L41/047 ; H03H3/04 ; H03H3/10 ; H03H9/13 ; H03H9/145 ; H03H9/17 ; H03H9/25 ; H03H9/56 ; H03H9/64
Abstract:
A substrate for a surface acoustic wave device or bulk acoustic wave device, comprising a support substrate and an piezoelectric layer on the support substrate, wherein the support substrate comprises a semiconductor layer on a stiffening substrate having a coefficient of thermal expansion that is closer to the coefficient of thermal expansion of the material of the piezoelectric layer than that of silicon, the semiconductor layer being arranged between the piezoelectric layer and the stiffening substrate.
Public/Granted literature
- US10924081B2 Substrate for a temperature-compensated surface acoustic wave device or volume acoustic wave device Public/Granted day:2021-02-16
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