公开(公告)号：US12143093B2

公开(公告)日：2024-11-12

申请号：US18352972

申请日：2023-07-14

Applicant: Soitec

Inventor： Marcel Broekaart ,  Thierry Barge ,  Pascal Guenard ,  Ionut Radu ,  Eric Desbonnets ,  Oleg Kononchuk

IPC: H03H9/02 ,  A61B5/00 ,  A61B5/145 ,  A61B5/1459 ,  H03H3/02 ,  H03H3/04 ,  H03H3/10 ,  H03H9/13 ,  H03H9/145 ,  H03H9/17 ,  H03H9/25 ,  H03H9/56 ,  H03H9/64 ,  H10N30/072 ,  H10N30/085 ,  H10N30/87 ,  H10N39/00

Abstract: A substrate for a surface acoustic wave device or bulk acoustic wave device, comprising a support substrate and an piezoelectric layer on the support substrate, wherein the support substrate comprises a semiconductor layer on a stiffening substrate having a coefficient of thermal expansion that is closer to the coefficient of thermal expansion of the material of the piezoelectric layer than that of silicon, the semiconductor layer being arranged between the piezoelectric layer and the stiffening substrate.

公开(公告)号：US20200228088A1

公开(公告)日：2020-07-16

申请号：US16829604

申请日：2020-03-25

Applicant: Soitec

Inventor： Marcel Broekaart ,  Thierry Barge ,  Pascal Guenard ,  Ionut Radu ,  Eric Desbonnets ,  Oleg Kononchuk

IPC: H03H9/02 ,  H01L41/312 ,  H03H3/02 ,  H01L27/20 ,  H01L41/047 ,  H03H3/04 ,  H03H3/10 ,  H03H9/13 ,  H03H9/145 ,  H03H9/17 ,  H03H9/25 ,  H03H9/56 ,  H03H9/64

Abstract: A substrate for a surface acoustic wave device or bulk acoustic wave device, comprising a support substrate and an piezoelectric layer on the support substrate, wherein the support substrate comprises a semiconductor layer on a stiffening substrate having a coefficient of thermal expansion that is closer to the coefficient of thermal expansion of the material of the piezoelectric layer than that of silicon, the semiconductor layer being arranged between the piezoelectric layer and the stiffening substrate.

公开(公告)号：US20180316329A1

公开(公告)日：2018-11-01

申请号：US15769698

申请日：2016-10-17

Applicant: Soitec

Inventor： Pascal Guenard ,  Ionut Radu ,  Didier Landru ,  Eric Desbonnets

IPC: H03H3/04 ,  H01L41/053 ,  H01L41/312 ,  H03H9/02 ,  H03H9/05

CPC classification number: H01L41/312 ,  H01L41/0805 ,  H03H9/02102 ,  H03H9/02574

Abstract: A composite structure for an acoustic wave device comprising a heterostructure includes: a useful layer of piezoelectric material, having a first face and a second face, the first face being arranged at a first bonding interface on a support substrate having a coefficient of thermal expansion less than that of the useful layer, wherein the composite structure further comprises a functional layer, an entire surface of which is arranged at a second bonding interface on the second face of the useful layer and having a coefficient of thermal expansion less than that of the useful layer. Methods are used for producing such a composite structure.

公开(公告)号：US11711065B2

公开(公告)日：2023-07-25

申请号：US17141065

申请日：2021-01-04

Applicant: Soitec

Inventor： Marcel Broekaart ,  Thierry Barge ,  Pascal Guenard ,  Ionut Radu ,  Eric Desbonnets ,  Oleg Kononchuk

IPC: A61B5/1459 ,  A61B5/00 ,  A61B5/145 ,  H03H9/02 ,  H03H3/02 ,  H10N30/072 ,  H10N30/87 ,  H10N39/00 ,  H03H3/04 ,  H03H3/10 ,  H03H9/13 ,  H03H9/145 ,  H03H9/17 ,  H03H9/25 ,  H03H9/56 ,  H03H9/64 ,  H10N30/085

CPC classification number: H03H9/02834 ,  A61B5/1459 ,  A61B5/14546 ,  A61B5/685 ,  H03H3/02 ,  H03H3/04 ,  H03H3/10 ,  H03H9/02102 ,  H03H9/02574 ,  H03H9/13 ,  H03H9/145 ,  H03H9/17 ,  H03H9/25 ,  H03H9/56 ,  H03H9/6489 ,  H10N30/072 ,  H10N30/87 ,  H10N39/00 ,  A61B2562/0204 ,  H03H2003/0407 ,  H10N30/085

Abstract: A substrate for a surface acoustic wave device or bulk acoustic wave device, comprising a support substrate and an piezoelectric layer on the support substrate, wherein the support substrate comprises a semiconductor layer on a stiffening substrate having a coefficient of thermal expansion that is closer to the coefficient of thermal expansion of the material of the piezoelectric layer than that of silicon, the semiconductor layer being arranged between the piezoelectric layer and the stiffening substrate.

公开(公告)号：US11335847B2

公开(公告)日：2022-05-17

申请号：US16072587

申请日：2017-01-17

Applicant: Soitec

Inventor： Oleg Kononchuk ,  Eric Butaud ,  Eric Desbonnets

IPC: H01L41/312 ,  H01L41/08 ,  H03H9/02 ,  H03H9/00 ,  H03H3/02

Abstract: The disclosure relates to a hybrid structure for a surface-acoustic-wave device comprising a useful layer of piezoelectric material joined to a carrier substrate having a thermal expansion coefficient lower than that of the useful layer; the hybrid structure comprising an intermediate layer located between the useful layer and the carrier substrate, the intermediate layer being a structured layer formed from at least two different materials comprising a plurality of periodic motifs in the plane of the intermediate layer.

公开(公告)号：US20220076992A1

公开(公告)日：2022-03-10

申请号：US17417715

申请日：2019-12-23

Applicant: Soitec

Inventor： Yvan Morandini ,  Walter Schwarzenbach ,  Frédéric Allibert ,  Eric Desbonnets ,  Bich-Yen Nguyen

IPC: H01L21/762 ,  H01L21/02 ,  H01L21/322 ,  H01L27/12 ,  H01L29/06

Abstract: A semiconductor-on-insulator multilayer structure, comprises: —a stack, called the back stack, of the following layers from a back side to a front side of the structure: a semiconductor carrier substrate the electrical resistivity of which is between 500 Ω·cm and 30 kΩ·cm, a first electrically insulating layer, a first semiconductor layer, —at least one trench isolation that extends through the back stack at least down to the first electrically insulating layer), and that electrically isolates two adjacent regions of the multilayer structure, the multilayer structure being characterized in that it further comprises at least one FD-SOI first region, and at least one RF-SOI second region.

公开(公告)号：US10924081B2

公开(公告)日：2021-02-16

申请号：US16829604

申请日：2020-03-25

Applicant: Soitec

Inventor： Marcel Broekaart ,  Thierry Barge ,  Pascal Guenard ,  Ionut Radu ,  Eric Desbonnets ,  Oleg Kononchuk

IPC: H03H9/02 ,  H03H3/02 ,  H03H3/04 ,  H03H3/10 ,  H03H9/13 ,  H03H9/145 ,  H03H9/17 ,  H03H9/25 ,  H03H9/56 ,  H03H9/64 ,  H01L41/312 ,  H01L41/047 ,  H01L27/20 ,  H01L41/335

Abstract: A substrate for a surface acoustic wave device or bulk acoustic wave device, comprising a support substrate and an piezoelectric layer on the support substrate, wherein the support substrate comprises a semiconductor layer on a stiffening substrate having a coefficient of thermal expansion that is closer to the coefficient of thermal expansion of the material of the piezoelectric layer than that of silicon, the semiconductor layer being arranged between the piezoelectric layer and the stiffening substrate.

公开(公告)号：US10429436B2

公开(公告)日：2019-10-01

申请号：US15546252

申请日：2016-01-19

Applicant: Soitec

Inventor： Cédric Malaquin ,  Jean-Pierre Raskin ,  Eric Desbonnets

IPC: G01R31/26 ,  G01R31/28 ,  G01R29/08 ,  G01R29/12

Abstract: The disclosure relates to a device for measuring an electrical characteristic of a substrate comprising a support made of a dielectric material having a bearing surface, the support comprising an electrical test structure having a contact surface flush with the bearing surface of the support, the bearing surface of the support and the contact surface of the electrical test structure being suitable for coming into close contact with a substrate. The measurement device also comprises at least one connection bump contact formed on another surface of the support and electrically linked to the electrical test structure. This disclosure also relates to a system for characterizing a substrate and a method for measuring a characteristic of a substrate employing the measurement device.

公开(公告)号：US10270413B2

公开(公告)日：2019-04-23

申请号：US14782548

申请日：2014-03-21

Applicant: SOITEC

Inventor： Christophe Zinke ,  Eric Desbonnets

IPC: H01L41/22 ,  H03H3/08 ,  H03H9/25

Abstract: This disclosure relates to a method of fabrication of a surface acoustic wave device comprising the step (a) of providing a piezoelectric structure, the step (b) of providing a dielectric structure, wherein the step (b) comprises a step (b1) of metalizing the dielectric structure, and the method further comprising the step (c) of bonding the metalized dielectric structure to the piezoelectric structure.

公开(公告)号：US20190007024A1

公开(公告)日：2019-01-03

申请号：US16064419

申请日：2016-12-21

Applicant: Soitec

Inventor： Marcel Broekaart ,  Thierry Barge ,  Pascal Guenard ,  Ionut Radu ,  Eric Desbonnets ,  Oleg Kononchuk

IPC: H03H9/02 ,  H03H3/04 ,  H03H3/10 ,  H03H9/13 ,  H03H9/145 ,  H03H9/17 ,  H03H9/25 ,  H03H9/56 ,  H03H9/64 ,  H01L27/20 ,  H01L41/047

Abstract: A substrate for a surface acoustic wave device or bulk acoustic wave device, comprising a support substrate and an piezoelectric layer on the support substrate, wherein the support substrate comprises a semiconductor layer on a stiffening substrate having a coefficient of thermal expansion that is closer to the coefficient of thermal expansion of the material of the piezoelectric layer than that of silicon, the semiconductor layer being arranged between the piezoelectric layer and the stiffening substrate.