- 专利标题： SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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申请号： US16781703申请日： 2020-02-04
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公开(公告)号： US20200321222A1公开(公告)日： 2020-10-08
- 发明人: Dong Jin Kim , Jin Han Kim , Won Chul Do , Jae Hun Bae , Won Myoung Ki , Dong Hoon Han , Do Hyung Kim , Ji Hun Lee , Jun Hwan Park , Seung Nam Son , Hyun Cho , Curtis Zwenger
- 申请人： Amkor Technology, Inc.
- 优先权： com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@7bf6f2
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L21/683 ; H01L23/538 ; H01L23/00 ; H01L23/498
摘要：
A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.
公开/授权文献
- US11195726B2 Semiconductor device and manufacturing method thereof 公开/授权日：2021-12-07
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