公开(公告)号：US20200321222A1

公开(公告)日：2020-10-08

申请号：US16781703

申请日：2020-02-04

申请人： Amkor Technology, Inc.

发明人： Dong Jin Kim ,  Jin Han Kim ,  Won Chul Do ,  Jae Hun Bae ,  Won Myoung Ki ,  Dong Hoon Han ,  Do Hyung Kim ,  Ji Hun Lee ,  Jun Hwan Park ,  Seung Nam Son ,  Hyun Cho ,  Curtis Zwenger

IPC分类号： H01L21/48 ,  H01L21/683 ,  H01L23/538 ,  H01L23/00 ,  H01L23/498

摘要： A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.

公开(公告)号：US10008393B2

公开(公告)日：2018-06-26

申请号：US15041649

申请日：2016-02-11

申请人： Amkor Technology, Inc.

发明人： Dong Jin Kim ,  Jin Han Kim ,  Won Chul Do Do ,  Jae Hun Bae Bae ,  Won Myoung Ki ,  Dong Hoon Han ,  Do Hyung Kim ,  Ji Hun Lee ,  Jun Hwan Park ,  Seung Nam Son ,  Hyun Cho ,  Curtis Zwenger

IPC分类号： H01L21/48 ,  H01L21/683 ,  H01L23/538 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498

CPC分类号： H01L21/4857 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2221/68304 ,  H01L2221/68318 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68363 ,  H01L2224/1132 ,  H01L2224/131 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81224 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81464 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2224/81911 ,  H01L2224/81913 ,  H01L2224/81914 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83104 ,  H01L2224/83192 ,  H01L2224/92 ,  H01L2224/9202 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/1421 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012

摘要： A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.

公开(公告)号：US20180308712A1

公开(公告)日：2018-10-25

申请号：US16017735

申请日：2018-06-25

申请人： Amkor Technology, Inc.

发明人： Dong Jin Kim ,  Jin Han Kim ,  Won Chul Do Do ,  Jae Hun Bae Bae ,  Won Myoung Ki ,  Dong Hoon Han ,  Do Hyung Kim ,  Ji Hun Lee ,  Jun Hwan Park ,  Seung Nam Son ,  Hyun Cho ,  Curtis Zwenger

IPC分类号： H01L21/48 ,  H01L21/683 ,  H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L21/4857 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2221/68304 ,  H01L2221/68318 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68363 ,  H01L2224/1132 ,  H01L2224/131 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81224 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81464 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2224/81911 ,  H01L2224/81913 ,  H01L2224/81914 ,  H01L2224/83 ,  H01L2224/83005 ,  H01L2224/83104 ,  H01L2224/83192 ,  H01L2224/92 ,  H01L2224/9202 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/1421 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012

摘要： A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.

公开(公告)号：US20160276174A1

公开(公告)日：2016-09-22

申请号：US15041649

申请日：2016-02-11

申请人： Amkor Technology, Inc.

发明人： Dong Jin Kim ,  Jin Han Kim ,  Won Chul Do Do ,  Jae Hun Bae Bae ,  Won Myoung Ki ,  Dong Hoon Han ,  Do Hyung Kim ,  Ji Hun Lee ,  Jun Hwan Park ,  Seung Nam Son ,  Hyun Cho ,  Curtis Zwenger

IPC分类号： H01L21/48

CPC分类号： H01L21/4857 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L2221/68318 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2224/1132 ,  H01L2224/131 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81224 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81464 ,  H01L2224/81815 ,  H01L2224/8191 ,  H01L2224/81911 ,  H01L2224/81913 ,  H01L2224/81914 ,  H01L2224/83005 ,  H01L2224/83104 ,  H01L2224/83192 ,  H01L2224/92 ,  H01L2224/9202 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/1421 ,  H01L2924/1433 ,  H01L2924/14335 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2221/68304 ,  H01L2221/68363 ,  H01L21/56 ,  H01L21/4853

摘要： A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.

摘要翻译： 一种制造半导体器件的方法及其制造的半导体器件。 例如但不限于，本公开的各个方面提供了一种用于制造半导体器件的方法，以及由此制造的半导体器件，其包括不通过硅通孔的插入器。

公开(公告)号：US10553451B2

公开(公告)日：2020-02-04

申请号：US16017735

申请日：2018-06-25

申请人： Amkor Technology, Inc.

发明人： Dong Jin Kim ,  Jin Han Kim ,  Won Chul Do ,  Jae Hun Bae ,  Won Myoung Ki ,  Dong Hoon Han ,  Do Hyung Kim ,  Ji Hun Lee ,  Jun Hwan Park ,  Seung Nam Son ,  Hyun Cho ,  Curtis Zwenger

IPC分类号： H01L21/48 ,  H01L21/683 ,  H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56

摘要： A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that comprises an interposer without through silicon vias.