Invention Application
- Patent Title: IMAGE SENSOR MODULES INCLUDING PRIMARY HIGH-RESOLUTION IMAGERS AND SECONDARY IMAGERS
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Application No.: US17013287Application Date: 2020-09-04
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Publication No.: US20210014429A1Publication Date: 2021-01-14
- Inventor: Jukka Alasirnio , Tobias Senn , Ohad Meitav , Moshe Doron , Alireza Yasan , Mario Cesana , Florin Cutu , Hartmut Rudmann , Markus Rossi , Peter Roentgen , Daniel Perez Calero , Bassam Hallal , Jens Geiger
- Applicant: AMS SENSORS SINGAPORE PTE. LTD.
- Applicant Address: SG SINGAPORE
- Assignee: AMS SENSORS SINGAPORE PTE. LTD.
- Current Assignee: AMS SENSORS SINGAPORE PTE. LTD.
- Current Assignee Address: SG SINGAPORE
- Main IPC: H04N5/247
- IPC: H04N5/247 ; G03B37/04 ; G03B35/08 ; G03B15/05 ; G03B17/12 ; G02B13/00 ; H04N5/225 ; H04N5/33

Abstract:
Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.
Public/Granted literature
- US11575843B2 Image sensor modules including primary high-resolution imagers and secondary imagers Public/Granted day:2023-02-07
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