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公开(公告)号：US20210014429A1
公开(公告)日：2021-01-14
申请号：US17013287
申请日：2020-09-04
Applicant: AMS SENSORS SINGAPORE PTE. LTD.
Inventor： Jukka Alasirnio , Tobias Senn , Ohad Meitav , Moshe Doron , Alireza Yasan , Mario Cesana , Florin Cutu , Hartmut Rudmann , Markus Rossi , Peter Roentgen , Daniel Perez Calero , Bassam Hallal , Jens Geiger
Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.
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公开(公告)号：US10771714B2
公开(公告)日：2020-09-08
申请号：US15121459
申请日：2015-02-23
Applicant: AMS SENSORS SINGAPORE PTE. LTD.
Inventor： Jukka Alasirniö , Tobias Senn , Ohad Meitav , Moshe Doron , Alireza Yasan , Mario Cesana , Florin Cutu , Hartmut Rudmann , Markus Rossi , Peter Roentgen , Daniel Perez Calero , Bassam Hallal , Jens Geiger
Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.
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公开(公告)号：US10302863B2
公开(公告)日：2019-05-28
申请号：US15587687
申请日：2017-05-05
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Guo Xiong Wu , Cris Calsena , James Eilertsen , Qichuan Yu , Tobias Senn , Han Nee Ng
Abstract: The present disclosure describes methods of attaching surfaces together. In one aspect, a method includes depositing a first adhesive onto a first surface of a first item, the first adhesive forming a pattern that at least partially surrounds a region of the first surface where there is no first adhesive. A second adhesive is jetted onto the region of the first surface, wherein the second adhesive has a viscosity lower than a viscosity of the first adhesive. The first surface of the first item and a second surface of a second item are brought into contact with one another. The method also includes curing the first and second adhesives. While the methods can be particularly suitable for manufacturing optical light guide elements, the methods also can be used in other contexts and applications as well.
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Patent Agency Ranking
4.发明授权公开(公告)号：US12015115B2
公开(公告)日：2024-06-18
申请号：US17148087
申请日：2021-01-13
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Tobias Senn , Julien Boucart , Susanne Westenhöfer
IPC: H01L33/64 , H01L27/146 , H01L33/00 , H01L33/48 , H01L33/56 , H01S5/0232 , H01S5/0236 , H01S5/024
CPC classification number: H01L33/648 , H01L27/14618 , H01L27/14685 , H01L33/0095 , H01L33/486 , H01L33/56 , H01S5/0232 , H01S5/0236 , H01S5/02423 , H01L2933/0058
Abstract: An optoelectronic module includes a spacer with an optical component mounting surface, a fluid permeable channel, and a module mounting surface. The fluid permeable channel and module mounting surface allow the channels to be sealed to foreign matter during certain manufacturing steps and to remain free from blockages, such as solidified flux, during certain manufacturing steps. Further, the channels can permit heat to escape from the optoelectronic module during operation.
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公开(公告)号：US10459187B2
公开(公告)日：2019-10-29
申请号：US14970795
申请日：2015-12-16
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Jukka Alasirniö , Tobias Senn , Markus Rossi , Hartmut Rudmann , Ohad Meitav , Moshe Doron , Kai Engelhardt
Abstract: Optical assemblies include a stack of optical elements each of which has one or more alignment features. Each alignment feature traces a respective curve along a surface of one of the optical elements. The alignment feature(s) of one optical element fit within the alignment feature(s) of the other. In some cases, the alignment features can help establish more precise lateral alignment of the optical elements.
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公开(公告)号：US11575843B2
公开(公告)日：2023-02-07
申请号：US17013287
申请日：2020-09-04
Applicant: AMS SENSORS SINGAPORE PTE. LTD.
Inventor： Jukka Alasirnio , Tobias Senn , Ohad Meitav , Moshe Doron , Alireza Yasan , Mario Cesana , Florin Cutu , Hartmut Rudmann , Markus Rossi , Peter Roentgen , Daniel Perez Calero , Bassam Hallal , Jens Geiger
Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.
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7.发明申请公开(公告)号：US20210135077A1
公开(公告)日：2021-05-06
申请号：US17148087
申请日：2021-01-13
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Tobias Senn , Julien Boucart , Susanne Westenhöfer
IPC: H01L33/64 , H01L27/146 , H01L33/00 , H01L33/48 , H01L33/56 , H01S5/024 , H01S5/0231 , H01S5/0236
Abstract: An optoelectronic module includes a spacer with an optical component mounting surface, a fluid permeable channel, and a module mounting surface. The fluid permeable channel and module mounting surface allow the channels to be sealed to foreign matter during certain manufacturing steps and to remain free from blockages, such as solidified flux, during certain manufacturing steps. Further, the channels can permit heat to escape from the optoelectronic module during operation.
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公开(公告)号：US10371954B2
公开(公告)日：2019-08-06
申请号：US15318025
申请日：2015-06-04
Applicant: ams Sensors Singapore Pte. Ltd.
Inventor： Daniel Perez Calero , Kai Engelhardt , Hartmut Rudmann , Tobias Senn
Abstract: The present disclosure describes optoelectronic modules (e.g., hybrid lens array packages) that have multiple optical channels, each of which includes at least one beam shaping element (e.g., a lens) that is part of a laterally contiguous array. Each optical channel is associated with a respective light sensitive region of an image sensor. Some or all of the channels also can include at least one beam shaping element (e.g., a lens) that is not part of a laterally contiguous array. In some cases, the arrays can include alignment features to facilitate alignment of the arrays with one another.
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