公开(公告)号：US12130454B2

公开(公告)日：2024-10-29

申请号：US17318345

申请日：2021-05-12

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Nicola Spring ,  Hartmut Rudmann ,  Markus Rossi

IPC: B29D11/00 ,  F21V7/00 ,  G02B3/00 ,  G02B5/04 ,  G02B6/12 ,  G02B6/122 ,  G02B6/13 ,  G02B6/34 ,  G02B13/00 ,  G02B17/08 ,  G02B6/43

CPC classification number: G02B5/045 ,  B29D11/00692 ,  B29D11/00721 ,  F21V7/0091 ,  G02B3/0062 ,  G02B5/04 ,  G02B6/12004 ,  G02B6/122 ,  G02B6/13 ,  G02B6/34 ,  G02B13/0065 ,  G02B17/0856 ,  G02B2006/12114 ,  G02B2006/12166 ,  G02B6/43

Abstract: The method for manufacturing optical light guide elements comprises providing a plurality of initial bars, each initial bar extending along a respective initial-bar direction from a first bar end to a second bar end and having a first side face extending from the first bar end to the second bar end, the first side face being reflective; positioning the initial bars in a row with their respective initial-bar directions aligned parallel to each other and with their respective first surfaces facing towards a neighboring one of the initial bars; and fixing the plurality of initial bars with respect to each other in the position to obtain a bar arrangement.

公开(公告)号：US20220028908A1

公开(公告)日：2022-01-27

申请号：US17498105

申请日：2021-10-11

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Simon Gubser ,  Mario Cesana ,  Markus Rossi ,  Hartmut Rudmann

IPC: H01L27/146 ,  H01L31/0203 ,  H01L33/54 ,  H01L51/52 ,  H01L51/56

Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

公开(公告)号：US11005001B2

公开(公告)日：2021-05-11

申请号：US15939636

申请日：2018-03-29

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Hartmut Rudmann ,  Markus Rossi

IPC: H01L31/16 ,  H01L27/146 ,  G02B13/00 ,  H01L25/16 ,  H01L31/0232 ,  H01L31/167 ,  G02B3/00 ,  G01J1/02 ,  G01J5/04 ,  G01J1/04 ,  G01J1/06 ,  G01J1/42 ,  G01J5/00 ,  G01J5/02 ,  G01J5/20 ,  G01J5/08 ,  B29D11/00

Abstract: Manufacturing opto-electronic modules (1) includes providing a substrate wafer (PW) on which detecting members (D) are arranged; providing a spacer wafer (SW); providing an optics wafer (OW), the optics wafer comprising transparent portions (t) transparent for light generally detectable by the detecting members and at least one blocking portion (b) for substantially attenuating or blocking incident light generally detectable by the detecting members; and preparing a wafer stack (2) in which the spacer wafer (SW) is arranged between the substrate wafer (PW) and the optics wafer (OW) such that the detecting members (D) are arranged between the substrate wafer and the optics wafer. Emission members (E) for emitting light generally detectable by the detecting members (D) can be arranged on the substrate wafer (PW). Single modules (1) can be obtained by separating the wafer stack (2) into separate modules.

公开(公告)号：US10903197B2

公开(公告)日：2021-01-26

申请号：US15973714

申请日：2018-05-08

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Hartmut Rudmann

IPC: H01L27/146 ,  H01L23/544 ,  H01L25/16 ,  H01L25/075 ,  H01L33/58

Abstract: A method of forming a wafer stack includes providing a sub-stack comprising a first wafer and a second wafer. The sub-stack includes a first thermally-curable adhesive at an interface between the upper surface of the first wafer and the lower surface of the second wafer. A third wafer is placed on the upper surface of the second wafer. A second thermally-curable adhesive is present at an interface between the upper surface of the second wafer and the lower surface of the third wafer. Ultra-violet (UV) radiation is provided in a direction of the upper surface of the third wafer to cure a UV-curable adhesive in openings in the second wafer and in contact with portions of the third wafer so as to bond the third wafer to the sub-stack at discrete locations. Subsequently, the third wafer and the sub-stack are heated so to cure the first and second thermally-curable adhesives.

公开(公告)号：US20200271886A1

公开(公告)日：2020-08-27

申请号：US16646707

申请日：2018-08-16

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Hartmut Rudmann ,  Alexander Bietsch

IPC: G02B7/02

Abstract: The device (10) comprises a first member (1) and a second member (2) which are stacked upon each other in a direction vertical direction. The first and second members comprise a central portion (C1; C2) each, and the first member (1) comprises at least a first distancing element (4) abutting the second member (2). The device (10) comprises a gap zone (G) and a bonding material (3), wherein the gap zone is peripheral to the central portions (C1; C2), and in the gap zone (G), a gap (5) is present between the first and second members. A portion of the gap (5) is filled by the bonding material (3) bonding the first and second members to each other in a bonding zone (B) comprised in the gap zone. A height (h) of the gap (5) is defined by the first distancing element (4).

公开(公告)号：US10680023B2

公开(公告)日：2020-06-09

申请号：US16357627

申请日：2019-03-19

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Hartmut Rudmann ,  Mario Cesana ,  Jens Geiger ,  Peter Roentgen ,  Vincenzo Condorelli

IPC: H01L27/14 ,  H01L27/146

Abstract: Optoelectronic modules include a silicon substrate in which or on which there is an optoelectronic device. An optics assembly is disposed over the optoelectronic device, and a spacer separates the silicon substrate from the optics assembly. Methods of fabricating such modules also are described.

公开(公告)号：US10459187B2

公开(公告)日：2019-10-29

申请号：US14970795

申请日：2015-12-16

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Jukka Alasirniö ,  Tobias Senn ,  Markus Rossi ,  Hartmut Rudmann ,  Ohad Meitav ,  Moshe Doron ,  Kai Engelhardt

IPC: G02B7/02 ,  G02B7/00

Abstract: Optical assemblies include a stack of optical elements each of which has one or more alignment features. Each alignment feature traces a respective curve along a surface of one of the optical elements. The alignment feature(s) of one optical element fit within the alignment feature(s) of the other. In some cases, the alignment features can help establish more precise lateral alignment of the optical elements.

公开(公告)号：US10431571B2

公开(公告)日：2019-10-01

申请号：US14367352

申请日：2012-12-18

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Hartmut Rudmann ,  Markus Rossi ,  Renè Kromhof

IPC: H01L25/16 ,  H01L23/053 ,  H01L25/00 ,  H01L33/58 ,  H01L23/00

Abstract: The opto-electronic module comprises a substrate member (P); at least one emission member (E1; E2) mounted on said substrate (P); at least one detecting member (D) mounted on said substrate (P); at least one optics member (O) comprising at least one passive optical component (L); at least one spacer member (S) arranged between said substrate member (P) and said optics member (O). The opto-electronic modules can be very small and can be produced in high quality in high volumes. In particular, at least two emission members (E1, E2), e.g., two LEDs, are provided, for emitting light of variable color. This can improve illumination of a scene.

公开(公告)号：US20190271828A1

公开(公告)日：2019-09-05

申请号：US16294497

申请日：2019-03-06

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Christian Tang-Jespersen ,  Michael Kiy ,  Miguel Bruno Vaello Paños ,  Florin Cutu ,  James Patrick Long ,  Hartmut Rudmann

IPC: G02B7/28 ,  G01S17/10 ,  G03B13/36 ,  G01S17/32 ,  H04N5/232 ,  G03B13/20 ,  G02B7/40 ,  G02B7/32 ,  H04N5/225

Abstract: The present disclosure describes imaging techniques and devices having improved autofocus capabilities. The imaging techniques can include actively illuminating a scene and determining distances over the entire scene and so that a respective distance to each object or point in the scene can be determined. Thus, distances to all objects in a scene (within a particular range) at any given instant can be stored. A preview of the image can be displayed so as to allow a user to select a region of the scene of interest. In response to the user's selection, the imager's optical assembly can be adjusted automatically, for example, to a position that corresponds to optimal image capture of objects at the particular distance of the selected region of the scene.

公开(公告)号：US10236314B2

公开(公告)日：2019-03-19

申请号：US15341210

申请日：2016-11-02

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Markus Rossi ,  Hartmut Rudmann ,  Stephan Heimgartner ,  Alexander Bietsch ,  Robert Lenart

IPC: H01L27/14 ,  H01L27/146 ,  H01L27/148

Abstract: The optical device comprises a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion. The device furthermore comprises non-transparent material applied onto said surrounding portion. The opto-electronic module comprises a plurality of these optical devices comprised in said first substrate.The method for manufacturing an optical device comprises the steps of a) providing a first substrate comprising at least one optical structure comprising a main portion and a surrounding portion at least partially surrounding said main portion; and b) applying a non-transparent material onto at least said surrounding portion. Said non-transparent material is present on at least said surrounding portion still in the finished optical device.