Invention Application
- Patent Title: METHOD OF MANUFACTURING LIGHT EMITTING ELEMENT
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Application No.: US16945729Application Date: 2020-07-31
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Publication No.: US20210036182A1Publication Date: 2021-02-04
- Inventor: Masayuki IBARAKI , Minoru YAMAMOTO , Naoto INOUE , Hiroaki TAMEMOTO
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Priority: JP2019-143119 20190802
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/20 ; H01L25/075

Abstract:
A method of manufacturing a light emitting element according to certain embodiments of the present disclosure includes: scanning and irradiating a first laser light having a first irradiation intensity to a sapphire substrate along predetermined dividing lines collectively in a shape of a tessellation of a plurality of hexagonal shapes in a top view to create a plurality of first modified regions along the predetermined dividing lines; and scanning and irradiating a second laser light having a second irradiation intensity greater than the first irradiation intensity to the sapphire substrate along the predetermined dividing lines to create a plurality of second modified regions overlapping the plurality of first modified regions.
Public/Granted literature
- US11769852B2 Method of cutting a substrate along dividing lines Public/Granted day:2023-09-26
Information query
IPC分类: