Invention Application
- Patent Title: MODULAR CAPACITOR SUBASSEMBLY FOR BACKUP POWER
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Application No.: US17081502Application Date: 2020-10-27
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Publication No.: US20210045247A1Publication Date: 2021-02-11
- Inventor: John Hung , Andrew Morning-Smith , Kai-Uwe Schmidt , Nan Allison Yao
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H01R12/73

Abstract:
An embodiment of an electronic system comprises a main board, and a modular capacitor subassembly mechanically and electrically coupled to the main board, wherein the modular capacitor subassembly provides backup power for the main board, and wherein the main board is adapted for use in at least two housing form factors. Other embodiments are disclosed and claimed.
Public/Granted literature
- US12207409B2 Modular capacitor subassembly for backup power Public/Granted day:2025-01-21
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