- 专利标题： POLISHING COMPOSITIONS AND METHODS OF USE THEREOF
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申请号： US17024766申请日： 2020-09-18
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公开(公告)号： US20210087431A1公开(公告)日： 2021-03-25
- 发明人: Yannan Liang , Liqing Wen , Bin Hu , Tawei Lin
- 申请人： Fujifilm Electronic Materials U.S.A., Inc.
- 申请人地址： US RI N. Kingstown
- 专利权人： Fujifilm Electronic Materials U.S.A., Inc.
- 当前专利权人： Fujifilm Electronic Materials U.S.A., Inc.
- 当前专利权人地址： US RI N. Kingstown
- 主分类号： C09G1/02
- IPC分类号： C09G1/02 ; C23F3/00
摘要：
A polishing composition includes an abrasive; a pH adjuster; a barrier film removal rate enhancer; a first low-k removal rate inhibitor; a second low-k removal rate inhibitor; an azole-containing corrosion inhibitor; and a cobalt corrosion inhibitor. This disclosure also relates to a method of polishing a substrate that comprises cobalt using the polishing compositions described herein.
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