- 专利标题： FAN MODULE INTERCONNECT APPARATUS FOR ELECTRONIC DEVICES
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申请号： US17132846申请日： 2020-12-23
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公开(公告)号： US20210120699A1公开(公告)日： 2021-04-22
- 发明人: Chee How Lim , Khai Ern See , Chin Kung Goh , Twan Sing Loo
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; G06F1/20
摘要：
Fan module interconnect apparatus are disclosed. An example fan module includes a fan and a fan housing to carry the fan. The fan is to rotate in the fan housing. A flange extends from the fan housing and including signal paths to provide an interconnect to electrically couple at least portions of a first electrical circuit and a second electrical circuit of an electronic device.
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