公开(公告)号：US09606949B1

公开(公告)日：2017-03-28

申请号：US14864019

申请日：2015-09-24

申请人： INTEL CORPORATION

发明人： Khang Choong Yong ,  Khai Ern See ,  Amit Kumar Srivastava ,  Jackson Chung Peng Kong ,  Teong Keat Beh ,  Eng Huat Goh

IPC分类号： G06F3/00 ,  G06F13/38 ,  G06F13/40 ,  G06F3/06 ,  G06F11/14

CPC分类号： G06F13/385 ,  G06F3/0634 ,  G06F3/065 ,  G06F3/0673 ,  G06F11/1456 ,  G06F13/4022 ,  G06F13/4081 ,  G06F2201/84

摘要： A universal interconnection scheme enables system architecture modularization with a hot-pluggable external computing module, such as a PC-on-a-card device using USB type-C technology. With the flexibility to interchange the system computing module with an external module, system performance can be augmented to fulfill the essential needs of the user, whether the system is a portable low-power tablet device, a smartphone, a wearable device such as an Internet of Things device, or a high-performance PC.

公开(公告)号：US20160216731A1

公开(公告)日：2016-07-28

申请号：US14604531

申请日：2015-01-23

申请人： Intel Corporation

发明人： Eng Huat Goh ,  Khai Ern See ,  Damien Weng Kong Chong ,  Min Suet Lim ,  Ping Ping Ooi ,  Chu Aun Lim ,  Jimmy Huat Since Huang ,  Poh Tat Oh ,  Teong Keat Beh ,  Jackson Chung Peng Kong ,  Fern Nee Tan ,  Jenn Chuan Cheng

IPC分类号： G06F1/16 ,  H05K1/18 ,  G06F1/18 ,  G06F13/38

CPC分类号： G06F1/163 ,  G06F1/16 ,  G06F1/1656 ,  G06F1/187 ,  G06F13/38 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Embodiments are generally directed to an apparatus utilizing computer on package construction. An embodiment of a computer includes a substrate; one or more semiconductor devices, the one or more semiconductor devices being direct chip attached to the substrate, the one or more semiconductor devices including a central processing unit (CPU); and one or more additional components installed on the substrate, wherein the computer excludes I/O components.

摘要翻译： 实施例一般涉及利用计算机在包装结构上的装置。 计算机的一个实施例包括基板; 一个或多个半导体器件，所述一个或多个半导体器件是直接芯片附着到所述衬底，所述一个或多个半导体器件包括中央处理单元（CPU）; 以及安装在基板上的一个或多个附加部件，其中计算机不包括I / O部件。

公开(公告)号：US20210212205A1

公开(公告)日：2021-07-08

申请号：US17212016

申请日：2021-03-25

申请人： Intel Corporation

发明人： Khai Ern See ,  Jia Lin Liew ,  Tin Poay Chuah ,  Chee How Lim ,  Yi How Ooi

IPC分类号： H05K1/11 ,  H05K1/02 ,  H05K3/42 ,  H05K3/00

摘要： Techniques for power tunnels on circuit boards are disclosed. A power tunnel may be created in a circuit board by drilling through non-conductive layers to a conductive trace and then filling in the hole with a conductor. A power tunnel can have a high cross-sectional area and can carry a larger amount of current than an equivalent-width trace, reducing the area on a circuit board required to carry that amount of current.

公开(公告)号：USD759029S1

公开(公告)日：2016-06-14

申请号：US29527683

申请日：2015-05-21

申请人： Intel Corporation

设计人： Howe Yin Loo ,  Greg A. La Tour ,  Chan Kim Lee ,  Bok Eng Cheah ,  Khai Ern See ,  Han Kung Chua ,  Chow Soon Lim ,  Choy Mei Yeow

公开(公告)号：US20210397219A1

公开(公告)日：2021-12-23

申请号：US17359224

申请日：2021-06-25

申请人： Intel Corporation

发明人： Jeff Ku ,  Jose Oviedo Salazar ,  Twan Sing Loo ,  Khai Ern See ,  Min Suet Lim

IPC分类号： G06F1/16

摘要： Electronic devices with moveable display screens are described herein. An example electronic device includes a lid having a first display screen and a base. The lid is moveably coupled to the base. The base includes a housing having a top side and a bottom side, a physical keyboard to be accessed on the top side of the housing, and a second display screen moveable between a first position in which the keyboard is exposed and a second position in which the second display screen covers the keyboard.

公开(公告)号：US20210120699A1

公开(公告)日：2021-04-22

申请号：US17132846

申请日：2020-12-23

申请人： Intel Corporation

发明人： Chee How Lim ,  Khai Ern See ,  Chin Kung Goh ,  Twan Sing Loo

IPC分类号： H05K7/20 ,  G06F1/20

摘要： Fan module interconnect apparatus are disclosed. An example fan module includes a fan and a fan housing to carry the fan. The fan is to rotate in the fan housing. A flange extends from the fan housing and including signal paths to provide an interconnect to electrically couple at least portions of a first electrical circuit and a second electrical circuit of an electronic device.

公开(公告)号：US11445608B2

公开(公告)日：2022-09-13

申请号：US16903845

申请日：2020-06-17

申请人： Intel Corporation

发明人： Chee How Lim ,  Eng Huat Goh ,  Jon Sern Lim ,  Khai Ern See ,  Min Suet Lim ,  Tin Poay Chuah ,  Yew San Lim

IPC分类号： H05K1/14 ,  H01R12/61 ,  H05K1/11

摘要： An electronic device may include a chassis. The electronic device may include a first electronic component that may include a first substrate and a first interconnect. The electronic device may include a second electronic component that may include a second substrate and a second interconnect. The second substrate may be physically separated from the first substrate. An electrical trace may be coupled to the chassis of the electronic device. The electrical trace may be sized and shaped to interface with the first interconnect of the first electronic component. The electrical trace may be sized and shaped to interface with the second interconnect of the second electronic component. The first electronic component and the second electronic component may be in electrical communication through the electrical trace coupled to the chassis of the electronic device.

公开(公告)号：US20210100101A1

公开(公告)日：2021-04-01

申请号：US16903845

申请日：2020-06-17

申请人： Intel Corporation

发明人： Chee How Lim ,  Eng Huat Goh ,  Jon Sern Lim ,  Khai Ern See ,  Min Suet Lim ,  Tin Poay Chuah ,  Yew San Lim

IPC分类号： H05K1/14 ,  H05K1/11 ,  H01R12/61

摘要： An electronic device may include a chassis. The electronic device may include a first electronic component that may include a first substrate and a first interconnect. The electronic device may include a second electronic component that may include a second substrate and a second interconnect. The second substrate may be physically separated from the first substrate. An electrical trace may be coupled to the chassis of the electronic device. The electrical trace may be sized and shaped to interface with the first interconnect of the first electronic component. The electrical trace may be sized and shaped to interface with the second interconnect of the second electronic component. The first electronic component and the second electronic component may be in electrical communication through the electrical trace coupled to the chassis of the electronic device.

公开(公告)号：US10317938B2

公开(公告)日：2019-06-11

申请号：US14604531

申请日：2015-01-23

申请人： Intel Corporation

发明人： Eng Huat Goh ,  Khai Ern See ,  Damien Weng Kong Chong ,  Min Suet Lim ,  Ping Ping Ooi ,  Chu Aun Lim ,  Jimmy Huat Since Huang ,  Poh Tat Oh ,  Teong Keat Beh ,  Jackson Chung Peng Kong ,  Fern Nee Tan ,  Jenn Chuan Cheng

IPC分类号： G06F1/16 ,  H05K1/18 ,  G06F1/18 ,  G06F13/38

摘要： Embodiments are generally directed to an apparatus utilizing computer on package construction. An embodiment of a computer includes a substrate; one or more semiconductor devices, the one or more semiconductor devices being direct chip attached to the substrate, the one or more semiconductor devices including a central processing unit (CPU); and one or more additional components installed on the substrate, wherein the computer excludes I/O components.