- 专利标题: DIELECTRIC MATERIAL, DEVICE COMPRISING DIELECTRIC MATERIAL, AND METHOD OF PREPARING DIELECTRIC MATERIAL
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申请号: US17126902申请日: 2020-12-18
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公开(公告)号: US20210198801A1公开(公告)日: 2021-07-01
- 发明人: Hyungjun KIM , Chan KWAK , Takayoshi SASAKI , Yasuo EBINA , Changsoo LEE , Dohwon JUNG , Giyoung JO , Takaaki TANIGUCHI
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Suwon-si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2019-0178510 20191230
- 主分类号: C30B1/02
- IPC分类号: C30B1/02 ; C03C17/23 ; C03C17/00
摘要:
Provided are a dielectric material, a device including the dielectric material, and a method of preparing the dielectric material, in which the dielectric material may include: a layered perovskite compound, wherein the layered perovskite compound may include at least one selected from a Dion-Jacobson phase, an Aurivillius phase, and a Ruddlesden-Popper phase, a temperature coefficient of capacitance (TCC) of a capacitance at 200° C. with respect to a capacitance at 40° C. may be in a range of about −15 percent (%) to about 15%, and a permittivity of the dielectric material may be 200 or greater in a range of about 1 kilohertz (kHz) to about 1 megahertz (MHz).
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