Embodiments disclosed herein include electronic packaged assemblies. In an embodiment, an electronic package comprises first and second surfaces. The second surface has a land pad in a land pad opening. The land pad is spaced away from the land pad opening by an outer gap. The land pad is a closed loop. In an embodiment, the electronic package is electrically coupled to a socket. The socket has an interconnect with a first connector and a second connector. The first connector of the interconnect is directly coupled to at least one portion of the closed loop. In an embodiment, when the first connector is coupled to at least two or more portions of the closed loop, the portions are spaced away from each other by a portion of the inner or outer gap. The closed loop comprises a conductive line continuously extending from a first end to a second end.